Curable and cured adhesive compositions

ABSTRACT

Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10−4) inverse Pascals at 25° C., a creep compliance that is greater than 1(10−3) inverse Pascals at 70° C., and a shear storage modulus greater than 40 kiloPascals when measured at 25° C. at a frequency of 1 radian/second.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. application Ser. No.15/761,997, filed Mar. 21, 2018, which is a national stage filing under35 U.S.C. 371 of PCT/US2016/051223, filed Sep. 12, 2016, which claimsthe benefit of U.S. Provisional Application No. 62/235,152, filed Sep.30, 2015, the disclosure of which is incorporated by reference inits/their entirety herein.

TECHNICAL FIELD

Curable adhesive compositions, cured adhesive compositions, articlescontaining the curable and cured adhesive compositions, and method ofmaking the articles are provided.

BACKGROUND

There is a high demand for new optically clear adhesives (OCA) for gapfilling between an outer cover lens or sheet (e.g., such as those basedon glass, polyethylene terephthalate, polycarbonate, poly(methylmethacrylate), cyclic olefin copolymer, and the like) and an underlyingdisplay module of an electronic display assembly. The presence of theOCA improves the performance of the display by reducing the refractiveindex mismatch between substrates and the air gap while also providingstructural support to the assembly. Filling the gap with an indexmatching adhesive reduces sunlight and ambient light reflectionsinherent in the use of multi-layered display panels; as a result,contrast and brightness of conventional display panels are improved.

During the manufacture of certain display devices two rigid substrates,such as a liquid crystal display (LCD) and a glass or polycarbonatecover lens, must be optically coupled by the OCA. In many cases, acapacitive touch sensor is also introduced between the LCD and the coverlens. One or more layers of OCA, either as a liquid optically clearadhesive (LOCA) or as an optically clear adhesive film (e.g., a die-cutfilm, which can be referred to as a contrast enhancement film (CEF)) canbe used to assemble the top layers of the display module.

Newer display devices have been using film based touch sensors insteadof the original glass based sensors. These film based touch sensors aremuch more compliant and thus susceptible to deformation during assembly.When such deformation is significant and permanent, an optical defectknown as bright line can be present and the assemblers go to greatlengths to eliminate it. In addition, defects such as patterns orcreases introduced during the laminating process that also generatestress and uneven pressures on the LCD can cause unacceptable imagedistortions. These distortions are often referred to as “Mura”.

On the lens side, the OCAs typically also have to be able to completelyfill in the sharper corners of the decorative ink-steps. Liquidoptically clear adhesives (LOCAs) can cover ink-steps extremely well,but gap uniformity, curing shrinkage, and spillage have to be managedduring assembly. In contrast, film-like OCAs, such as CEF, have verygood caliper control and are easy to apply, but they may lack sufficientflow to cover the higher ink-steps, be compliant enough against the LCDto avoid Mura, and/or show sufficient leveling to avoid distortion ofplastic touch sensors.

The original film OCAs easily filled the ink-step gap and, after somework, were able to conform to a low black ink-step (about 25micrometers). As higher white ink-steps (about 70 micrometers) wereintroduced, a new generation of OCA films was introduced with theviscoelastic balance being shifted towards more viscous character. Thisnew generation of OCAs also had much lower crosslink density, so theOCAs retained significant flow to efficiently cover the ink-step. Inorder to make the assembly durable to environmental exposure, these OCAsalso were crosslinked using ultraviolet or visible light radiation afterthe autoclave step (which provides heat and time under pressure to allowadhesive flow).

The current trend is towards thinner mobile devices that are beingmanufactured using ink printed cover glass with a larger white ink-step(about 70 micrometers). The current UV curable OCAs cannot conform tothe larger ink-steps unless they are thick and heavy. That is, thethickness of the OCA often must be 3 to 4 times the thickness of theink-step height (i.e., the current OCA can cover features that are 33 to25 percent of its thickness).

SUMMARY

Curable adhesive compositions are provided that can be cured usingultraviolet or visible light radiation. These curable adhesivecompositions have desirable flow characteristics for use in a variety ofapplications, particularly in electronic display devices. Significantly,a layer (e.g., a film) of the curable adhesive compositions can flow tocover features (e.g., ink-steps) on a substrate having a height up to100 percent of its thickness. Advantageously, die-cut film layers of thecurable adhesive can remain dimensionally stable when stored and shippedat temperatures up to 40° C. (e.g., temperatures close to roomtemperature and up to 40° C.). That is, the die-cut film layers can bestored and transported without freezing and without refrigeration.

In a first aspect, a curable adhesive composition is provided thatcontains (1) a curable (meth)acrylate copolymer having a weight averagemolecular weight (Mw) in a range of 100,000 to 400,000 Daltons (Da) and(2) an optional photoinitiator. The curable (meth)acrylate copolymerincludes a first monomeric unit of Formula (I) in an amount in a rangeof 50 to 94 weight percent based on a total weight of monomeric units inthe curable (meth)acrylate copolymer.

In Formula (I), R₁ is hydrogen or methyl and R₂ is an alkyl,heteroalkyl, aryl, aralkyl, or alkaryl group. The curable (meth)acrylatecopolymer further includes a second monomeric unit of Formula (II) in anamount in a range of 6 to 10 weight percent based on the total weight ofmonomeric units in the curable (meth)acrylate copolymer.

Group R₁ is the same as defined above for Formula (I). The curable(meth)acrylate copolymer still further comprises a third monomeric unitof Formula (III) in an amount in a range of 0.05 to 5 weight percentbased on the total weight of monomeric units of the curable(meth)acrylate copolymer.

In Formula (III), group R₁ is the same as defined above and group R₃comprises 1) an aromatic ketone group that causes hydrogen abstractionfrom a polymeric chain when exposed to ultraviolet radiation or 2) a(meth)acryloyl group that undergoes free radical polymerization whenexposed to ultraviolet or visible light radiation in the presence of thephotoinitiator. The curable (meth)acrylate copolymer yet furthercomprises an optional fourth monomeric unit of Formula (IV) in an amountin a range of 0 to 20 weight percent based on the total weight ofmonomeric units of the curable (meth)acrylate copolymer.

In Formula (IV), group R₁ is the same as defined above, group X is —O—or —NH—, and group R₄ is a hydroxy-substituted alkyl orhydroxy-substituted heteroalkyl. The asterisk (*) in the variousformulas indicates a site of attachment to another monomeric unit or toa terminal group. The curable adhesive composition has a creepcompliance that is less than 5(10⁻⁴) inverse Pascals (Pa) at 25° C. anda creep compliance that is greater than 1(10⁻³) inverse Pascals (Pa) at70° C. The curable adhesive composition has a shear storage modulusequal to at least 40 kiloPascals (kPa) when measured at 25° C. and 1radian/second.

In a second aspect, a cured adhesive composition comprising a cured(meth)acrylate copolymer is provided. The cured adhesive composition isa reaction product resulting from exposing a curable adhesivecomposition to ultraviolet or visible light radiation. The curableadhesive composition is the same as described above in the first aspect.

In a third aspect, an article is provided that comprises a firstsubstrate and a layer of a curable adhesive composition positionedadjacent to (e.g., laminated to) the first substrate. The curableadhesive composition comprises (1) a curable (meth)acrylate copolymerand (2) an optional photoinitiator and is the same as described above inthe first aspect. In many embodiments, the layer of the curable adhesivecomposition is positioned between a first substrate and a secondsubstrate (e.g., the layer of the adhesive composition is laminated toboth the first and second substrate).

In a fourth aspect, an article is provided that comprises a firstsubstrate, a second substrate, and a layer of a cured adhesivecomposition positioned between the first substrate and the secondsubstrate (e.g., a layer of the cured adhesive composition is laminatedto both the first substrate and the second substrate). The curedadhesive composition comprises a cured (meth)acrylate copolymer that isthe same as described above in the second aspect.

In a fifth aspect, a method of preparing an article is provided. Themethod comprises providing a first substrate, a second substrate, and alayer of a curable adhesive composition layer. The curable adhesivecomposition comprises a curable (meth)acrylate copolymer plus anoptional photoinitiator and is the same as described above in the firstaspect. The method further comprises forming a laminate comprising thefirst substrate, the second substrate, and the layer of the curableadhesive composition, wherein the layer of the curable adhesivecomposition is positioned between the first substrate and the secondsubstrate. The method still further comprises exposing the layer of thecurable adhesive composition to ultraviolet or visible light radiationto form a layer of a cured adhesive composition.

The above summary of the present disclosure is not intended to describeeach disclosed embodiment or every implementation of the presentdisclosure. The description that follows more particularly exemplifiesillustrative embodiments. In several places throughout the application,guidance is provided through lists of examples, which can be used invarious combinations. In each instance, the recited list serves only asa representative group and should not be interpreted as an exclusivelist.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of an exemplary article according tothe present disclosure.

FIG. 2 is a schematic view of an exemplary method of making an articleaccording to the present disclosure.

DETAILED DESCRIPTION

New curable and cured adhesive compositions are needed that can be used,for example, in various electronic display assemblies. In particular,curable adhesive compositions are needed that are optically clear, thatare in the form of a layer (e.g., film) that can be cut with a die (diecut), that can retain the precise dimensions of the die-cut duringstorage and transport without refrigeration or freezing, and that havesufficient flow when subjected to autoclave temperatures (e.g.,temperatures in a range of 40° C. to 80° C.) to cover large ink-steps orother features (up to about 70 micrometers, up to 80 micrometers, up to90 micrometers, or up to 100 micrometers or even higher) present on asubstrate to which it is laminated. Although flow is important to coverthe ink-steps and other features, the amount of flow must be carefullycontrolled so that the adhesive composition does not cover othercomponents of the electronic display assemblies that need to remain freeof adhesive. That is, boundary control is becoming more important as theink border and bezel dimensions of the electronic display assembliescontinue to decrease.

Further, for use in electronic display assemblies, the adhesivecompositions typically need to be acid free or substantially acid free(less than 0.1 weight percent, less than 0.05 weight percent, less than0.01 weight percent, or less than 0.005 weight percent acidic groupsbased on the total weight of the adhesive) so that corrosion of variousmetal-containing components such as indium tin oxide or metals traceslike copper does not occur. Examples of acidic groups are carboxylicacid groups, phosphonic acid groups, and sulfonic acid groups.

Curable adhesive compositions are provided that can be in the form of alayer (e.g., film), that can be optically clear, that can have minimalor no acidic groups, that can be dimensionally stable for extendedperiods at temperatures close to room temperature (e.g., that can bedie-cut to a desired size and shape and retain that size and shape forextended periods at temperatures close to room temperature), and thatcan flow sufficiently but not excessively during lamination andautoclaving to cover various features (e.g., ink-steps) that may bepresent on a substrate(s) to which it is joined.

In many embodiments, the adhesive compositions are pressure-sensitiveadhesive compositions. According to the Pressure-Sensitive Tape Council,pressure-sensitive adhesives (PSAs) are defined to possess the followingproperties: (1) aggressive and permanent tack, (2) adherence with nomore than finger pressure, (3) sufficient ability to hold onto anadherend, and (4) sufficient cohesive strength to be removed cleanlyfrom the adherend. Materials that have been found to function well asPSAs include polymers designed and formulated to exhibit the requisiteviscoelastic properties resulting in a desired balance of tack, peeladhesion, and shear holding power. PSAs are characterized by beingnormally tacky at room temperature. Materials that are merely sticky oradhere to a surface do not constitute a PSA; the term PSA encompassesmaterials with additional viscoelastic properties. PSAs are adhesivesthat satisfy the Dahlquist criteria for tackiness, which means that theshear storage modulus is typically 3×10⁵ Pa (300 kPa) or less whenmeasured at 25° C. and 1 Hertz (6.28 radians/second). PSAs typicallyexhibit adhesion, cohesion, compliance, and elasticity at roomtemperature.

The term “adhesive composition” can refer herein to an adhesive thatcontains a curable (meth)acrylate copolymer and/or a cured(meth)acrylate copolymer. In many embodiments, the adhesive compositionis a pressure-sensitive adhesive composition.

As used herein, terms as “a,” “an,” and “the” are not intended to referto only a singular entity, but include the general class of which aspecific example may be used for illustration. These terms can be usedinterchangeably with the term “at least one.”

As used herein, the term “room temperature” refers to a temperature ofabout 20° C. to about 25° C. or about 22° C. to about 25° C.

The term “and/or” means one or all of the listed elements or acombination of any two or more of the listed elements.

The phrase “in a range of” or a similar phrase refers to all valueswithin the stated range plus the endpoints of the range.

The term “(meth)acryloyl” refers to a group of formula H₂C═CR₁—(CO)—where R₁ is hydrogen or methyl. That is, the (meth)acryloyl group is anacryloyl group (where R₁ is hydrogen) and/or a methacryloyl group (whereR₁ is methyl). The (meth)acryloyl group is often a (meth)acryloyloxygroup of formula H₂C═CR₁—(CO)—O— or a (meth)acryloylamido group offormula H₂C═CR₁—(CO)—NH—.

The term “(meth)acrylate copolymer” refers to a polymeric materialformed from two or more monomers (e.g., three or more monomers), whereinthe majority (at least 50 weight percent, at least 60 weight percent, atleast 70 weight percent, at least 80 weight percent, or at least 90weight percent) of the monomers used to form the copolymer are(meth)acrylates (e.g., alkyl (meth)acrylates, aryl (meth)acrylates,aralkyl (meth)acrylates, alkaryl (meth)acrylates, and heteroalkyl (meth)acrylate). The term (meth)acrylates includes methacrylates, acrylates,or both. The term (meth)acrylate copolymer can apply herein to theprecursor (meth)acrylate copolymer, and/or a curable (meth)acrylatecopolymer, and/or a cured (meth)acrylate copolymer.

As used herein, the term “precursor (meth)acrylate copolymer” refers toa (meth)acrylate copolymer that does not contain the third monomericunits of Formula (III) but that can be reacted with an unsaturatedreagent compound to form a curable (meth)acrylate copolymer. That is,the precursor (meth)acrylate copolymer can be converted to a curable(meth)acrylate copolymer having a pendant (meth)acryloyl group, which isthe second type of third monomeric unit of Formula (III).

As used herein, the term “curable (meth)acrylate copolymer” refers to a(meth)acrylate copolymer that has third monomeric units of Formula (III)in addition to the first monomeric units of Formula (I) and the secondmonomeric units of Formula (II). The third monomeric units of Formula(III) can be of the first type (having an aromatic ketone group), of thesecond type (having a pendant (meth)acryloyl group), or both. The thirdmonomeric units can undergo reaction when exposed to ultravioletradiation (or to ultraviolet or visible light radiation in the presenceof a photoinitiator). When the third monomeric units react to form acured (meth)acrylate copolymer, covalent bonds are formed betweendifferent polymeric chains or within the same polymeric chain. Thisreaction typically increases the weight average molecular weight of the(meth)acrylate copolymer.

As used herein, the term “cured (meth)acrylate copolymer” refers to a(meth)acrylate copolymer resulting from the exposure of the curable(meth)acrylate copolymer to ultraviolet radiation (or to ultraviolet orvisible light radiation in the presence a photoinitiator). In someembodiments, the material is considered cured when at least 50 weightpercent (e.g., at least 60 weight percent, at least 70 weight percent,at least 80 weight percent, at least 90 weight percent, or at least 95weight percent) of groups of Formula (III) have reacted to form acrosslinked site.

As used herein, the term “feature” refers to a structure projecting inthe z-direction (i.e., the z-direction corresponds to the height of thestructure) from a base of the substrate. The features can have any shapebut are often in the form of steps such as steps resulting from printingvarious components on the substrate. That is, in some embodiments, thefeatures are printed ink-steps. The feature often has a height, forexample, extending up to 100 micrometers or more, up to 80 micrometers,up to 70 micrometers, up to 60 micrometers, up to 40 micrometers, up to20 micrometers, or up to 10 micrometers from the base of the substrate.

As used herein, in reference to an adhesive layer, the term “dimensionalstability” refers to the ability of a die-cut film sample to retain itsoriginally cut length, width, and height within 0.5 millimeters, within0.30 millimeters, or within 0.15 millimeters when stored at 25° C. forone week as a single die-cut (i.e., not a stack of die-cuts whereposition in the stack and the method of stacking can influence thedimensional stability).

In many embodiments, particularly when the adhesive composition is usedin an electronic display assembly, optical clarity of both the(meth)acrylate copolymer and the adhesive composition are desirable. Asused herein, “optically clear” or “optical clarity” means that amaterial (in a 50 micron thick layer) has an optical transmission valueof at least 85 percent, preferably at least 90 percent. The term“optical transmission value” refers to the percentage of light that isnot reflected back toward the source as a percentage of the totalincident light in the visible region of the electromagnetic spectrum(i.e., the optical transmission value is equal to [(light intensityemitted/light intensity source)×100] at a wavelength of 400 nanometers(nm) to 700 nm). These optically clear materials also have (as measuredin a 50 micron thick layer) a haze value that is less than 2 percent anda close to color neutral on the CIE Lab color scale. Close to colorneutral means that any of the a* or b* values are less than 0.5.

The terms “die-cut layer”, “die-cut film”, and “die-cut film layer” areused interchangeably and refer to a layer of an adhesive layer, which istypically a curable adhesive layer, that has been cut to a desired shapeusing a die.

Adhesive compositions are provided that contain a curable (meth)acrylatecopolymer or a cured (meth)acrylate copolymer. These adhesivecompositions can be in the form of a layer or film. If desired, thelayer or film can be die cut (i.e., cut with a die) to any desired sizeand shape (e.g., the size and shape can be for use in an electronicdisplay assembly). The layer or film of the adhesive composition thatcontains a curable (meth)acrylate copolymer can be referred to as acurable adhesive composition. The curable (meth)acrylate copolymerwithin the curable adhesive composition can be cured by exposure toultraviolet radiation (or in some embodiments, by exposure toultraviolet or visible light radiation in the presence of aphotoinitiator). The resulting adhesive, which contains a cured(meth)acrylate copolymer, can be referred to as a cured adhesivecomposition. In many embodiments, both the curable and cured adhesivecompositions are pressure-sensitive adhesive compositions.

The curable (meth)acrylate copolymer includes at least three differenttypes of monomeric units: first monomeric units of Formula (I), secondmonomeric units of Formula (II), and third monomeric units of Formula(III). In some embodiments, the curable (meth)acrylate copolymerincludes optional fourth monomeric units of Formula (IV). Still otheroptional monomeric units can be included in the curable (meth)acrylatecopolymer. Depending on the selection of the third monomeric unit, whichincludes the group responsible for curing the (meth)acrylate copolymer,the curable (meth)acrylate copolymer can be formed directly from apolymerizable composition containing the corresponding first monomer,second monomer, third monomer, and other optional monomers. In someembodiments, particularly for curable (meth)acrylate copolymers having apendant (meth)acryloyl group, a precursor (meth)acrylate copolymer isinitially prepared and then further reacted with an unsaturated reagentcompound to form the third monomeric unit (having a pendant(meth)acryloyl group) and the resulting curable (meth)acrylatecopolymer.

Stated differently, some curable (meth)acrylate copolymers are formedfrom precursor (meth)acrylate copolymers while other curable(meth)acrylate copolymers are formed directly from its constituentmonomers. The precursor (meth)acrylate copolymer does not have a thirdmonomeric unit of Formula (III) but has a group in a fourth monomericunit of Formula (IV) that can be further reacted to form the second typeof third monomeric unit of Formula (III) having a (meth)acryloyl group.The precursor (meth)acrylate includes the first monomeric units ofFormula (I) and the second monomeric units of Formula (II). The curable(meth)acrylate copolymer formed from the precursor (meth)acrylatecopolymer has a third monomeric unit of Formula (III) with a pendant(meth)acryloyl group. The cured (meth)acrylate copolymer is formed byexposing the curable (meth)acrylate copolymer to ultraviolet radiationor by exposing the curable (meth)acrylate copolymer to ultraviolet orvisible light radiation in the presence of a photoinitiator.

Alternatively, a curable (meth)acrylate copolymer can have a first typeof third monomeric units of Formula (III) (with an aromatic ketonegroup) plus a group in a fourth monomeric unit of Formula (IV) that canbe further reacted to form the second type of third monomeric unit ofFormula (III) (with a pendant (meth)acryloyl group). Such a curable(meth)acrylate copolymer has both the first type of monomeric unit ofFormula (III) and the second type of monomeric unit of Formula (III).

The curable (meth)acrylate copolymer includes a first monomeric unit ofFormula (I) in an amount in a range of 50 to 94 weight percent based ona total weight of monomeric units in the curable (meth)acrylatecopolymer.

In Formula (I), R₁ is hydrogen or methyl and R₂ is an alkyl,heteroalkyl, aryl, aralkyl, or alkaryl group. Stated differently, thefirst monomeric unit is derived from an alkyl (meth)acrylate,heteroalkyl (meth)acrylate, aryl (meth)acrylate, aralkyl (meth)acrylate,alkaryl (meth)acrylate, or a mixture thereof (i.e., the (meth)acrylatecopolymer can be have multiple first monomeric units with different R₂groups). Suitable alkyl R₂ groups often have 1 to 32 carbon atoms, 1 to24 carbon atoms, 1 to 18 carbon atoms, 1 to 16 carbon atoms, 1 to 12carbon atoms, 1 to 10 carbon atoms, 1 to 8 carbon atoms, 1 to 6 carbonatoms, or 1 to 4 carbon atoms. The alkyl groups can be linear, branched,cyclic, or a combination thereof. Suitable heteroalkyl R² groups oftenhave 1 to 30 carbon atoms or more and 1 to 20 carbon atoms or more, 1 to20 carbon atoms and 1 to 10 heteroatoms, 1 to 16 carbon atoms and 1 to 8heteroatoms, 1 to 12 carbon atoms and 1 to 6 heteroatoms, or 1 to 10carbon atoms and 1 to 5 heteroatoms. The heteroatoms are often oxygen(oxy groups) but can be sulfur (—S— groups) or nitrogen (—NH— groups).Suitable aryl R₂ groups typically are carbocyclic aromatic groups. Thearyl group often has 6 to 12 carbon atoms or 6 to 10 carbon atoms. Inmany embodiments, the aryl is phenyl. Suitable aralkyl groups are offormula —R—Ar where R is an alkylene and Ar is an aryl. The alkylenegroups, which are a divalent radical of an alkane, typically have 1 to10 carbon atoms, 1 to 6 carbon atoms, or 1 to 4 carbon atoms and thearyl group typically has 6 to 12 carbon atoms, 6 to 10 carbon atoms, or6 carbon atoms. In many embodiments, the aryl is phenyl. Suitablealkaryl groups are of formula —Ar—R wherein Ar is an arylene (i.e., adivalent radical of a carbocyclic aromatic compound) and R is an alkyl.The arylene typically has 6 to 12 carbon atoms, 6 to 10 carbon atoms, or6 carbon atoms. In many embodiments, the arylene is phenylene. The alkylgroup of the alkaryl group is the same as described above for alkylgroups but often has 1 to 10 carbon atoms, 1 to 6 carbon atoms, or 1 to4 carbon atoms.

The R₂ group in Formula (I) often is an alkyl. Stated differently, thefirst monomeric unit is often derived from (i.e., formed from) an alkyl(meth)acrylate. Exemplary alkyl (meth)acrylates often include, but arenot limited to, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl(meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate,isobutyl (meth)acrylate, n-pentyl (meth)acrylate, isoamyl(meth)acrylate, 2-methylbutyl (meth)acrylate, n-hexyl (meth)acrylate,cyclohexyl (meth)acrylate, 4-methyl-2-pentyl (meth)acrylate,2-ethylhexyl (meth)acrylate, 2-methylhexyl (meth)acrylate, n-octyl(meth)acrylate, isooctyl (meth)acrylate, 2-octyl (meth)acrylate, n-nonyl(meth)acrylate, isononyl (meth)acrylate, isobornyl (meth)acrylate),adamantyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl(meth)acrylate, 2-propylheptyl (meth)acrylate, isotridecyl(meth)acrylate, isostearyl (meth)acrylate, octadecyl (meth)acrylate,2-octyldecyl (meth)acrylate, dodecyl (meth)acrylate, lauryl(meth)acrylate, and heptadecanyl (meth)acrylate. Some other exemplarybranched alkyl (meth)acrylates are (meth)acrylic acid esters of Guerbetalcohols having 12 to 32 carbon atoms as described in PCT PatentApplication Publication WO 2011/119363 (Clapper et al.). In someembodiments, the alkyl (meth)acrylate is chosen that has an alkyl groupwith no greater than 8 carbon atoms. These alkyl (meth)acrylate oftenhave a higher solubility parameter compared to those having an alkylgroup with greater than 8 carbon atoms. This can increase thecompatibility of this monomer with the (meth)acrylamide used to form thesecond monomeric units.

Group R₂ can be a heteroalkyl, aryl, aralkyl, or alkaryl group. Examplesof monomers with a heteroalkyl group include, but are not limited to,ethoxyethoxyethyl (meth)acrylate, polyethylene glycol (meth)acrylate,and polypropylene glycol (meth)acrylate. Examples of such monomersinclude, but are not limited to, 2-phenylethyl acrylate, 3-phenylethylacrylate, and 2-biphenylethyl acrylate.

The first monomeric unit is often selected to control the final glasstransition temperature (Tg) and shear storage modulus (G′) of the(meth)acrylate copolymer and the adhesive. In many embodiments, thealkyl (meth)acrylates are alkyl acrylates. The use of alkyl acrylatesrather than alkyl methacrylates often results in (meth)acrylatecopolymers having a lower glass transition temperature and lower shearstorage modulus (G′). The lower glass transition temperature and lowershear storage modulus (G′) of the (meth)acrylate copolymers may beneeded to provide a pressure-sensitive adhesive composition. The finalglass transition temperature (Tg) for the (meth)acrylate copolymer istypically equal to at least −20° C., at least −15° C., at least −10° C.,at least −5° C., or at least 0° C. and is often no greater than 40° C.,no greater than 30° C., no greater than 20° C., or no greater than 10°C. When the Tg exceeds 20° C., the adhesive may need to beheat-activated (i.e. upon heating slightly above the Tg, the materialbecomes tacky and adheres with no more than finger pressure). Uponcooling the below Tg these heat-activated adhesive will no longer betacky but have sufficient ability to hold onto an adherend and havesufficient cohesive strength to be cleanly removed from the adherend.The glass transition temperature can be measured using DynamicMechanical Analysis at a frequency of 1 radian/second as described inthe Examples section below.

The curable (meth)acrylate copolymer contains at least 50 weight percentof the first monomeric unit based on a total weight of the curable(meth)acrylate copolymer. If the amount of the first monomeric unit islower than at least 50 weight percent, the glass transition temperatureof the (meth)acrylate copolymer may not be suitable for apressure-sensitive adhesive. For example, the (meth)acrylate copolymeroften contains at least 55 weight percent, at least 60 weight percent,at least 65 weight percent, at least 70 weight percent, or at least 75weight percent of the first monomeric unit. The amount of the firstmonomeric unit can be up to 94 weight percent. If the amount of thefirst monomeric unit is greater than 94 weight percent, there may beinsufficient amounts of the second monomeric unit and the thirdmonomeric unit in the curable (meth)acrylate copolymer. For example, theamount can be up to 90 weight percent, up to 85 weight percent, or up to80 weight percent. In some embodiments, the amount of the firstmonomeric unit is in a range of 50 to 94 weight percent, 60 to 94 weightpercent, 70 to 94 weight percent, 80 to 94 weight percent, 60 to 90weight percent, 70 to 90 weight percent, or 80 to 90 weight percent. Theamounts are based on the total weight of the (meth)acrylate copolymer.

The curable (meth)acrylate copolymer further includes a second monomericunit of Formula (II) in an amount in a range of 6 to 10 weight percentbased on the total weight of monomeric units in the curable(meth)acrylate copolymer.

Group R₁ is hydrogen or methyl. Stated differently, the second monomericunit is derived from (meth)acrylamide, which refers to acrylamide and/ormethacrylamide.

The second monomeric unit advantageously provides hydrogen bondingwithin the curable (meth)acrylate copolymer. This hydrogen bonding tendsto enhance the dimensional stability of die-cut films of the adhesivecomposition prior to curing. Stated differently, dimensional stabilitycan be provided even though no covalent crosslinks have been formed inthe curable (meth)acrylate copolymer (i.e. covalent crosslinks form fromthe third monomeric unit of the curable (meth)acrylate when exposed toultraviolet radiation or when exposed to ultraviolet or visible lightradiation in the presence of a photoinitiator). The second monomericunit also can enhance adhesion of the cured adhesive composition tosubstrates and/or enhance the cohesive strength of both the curable andcured adhesive compositions.

The (meth)acrylate copolymer typically contains at least 6 weightpercent of the second monomeric unit. This amount is often needed toprovide the desired hydrogen bonding within the curable (meth)acrylatecopolymer. In some examples, the (meth)acrylate copolymer contains atleast 6.5 weight percent or at least 7 weight percent of the secondmonomeric unit. The amount of the second monomeric unit can be up to 10weight percent. If greater than 10 weight percent of the secondmonomeric unit is included in the (meth)acrylate copolymer, the glasstransition temperature may be too high to function as apressure-sensitive adhesive. Additionally, there may be miscibilityissues with the other monomers included in the polymerizable compositionused to form the (meth)acrylate copolymer. In some examples, the(meth)acrylate copolymer contains up to 9.5 weight percent, up to 9weight percent, up to 8.5 weight percent, or up to 8 weight percent ofthe second monomeric unit. The amount of the second monomeric unit isoften in a range of 6 to 10 weight percent, 6.5 to 10 weight percent, 6to 9 weight percent, or 6 to 8 weight percent based on a total weight ofthe (meth)acrylate copolymer.

The curable (meth)acrylate copolymer still further comprises a thirdmonomeric unit of Formula (III) in an amount in a range of 0.05 to 5weight percent based on the total weight of monomeric units of thecurable (meth)acrylate copolymer.

In Formula (III), group R₁ is the same as defined above and group R₃comprises 1) an aromatic ketone group that causes hydrogen abstractionfrom a polymeric chain when exposed to ultraviolet radiation or 2) a(meth)acryloyl group (i.e., pendant (meth)acryloyl group) that undergoesfree radical polymerization when exposed to ultraviolet or visible lightradiation in the presence of a photoinitator. The hydrogen abstractiontype aromatic ketone groups typically require exposure to ultravioletradiation to trigger a reaction. The pendant (meth)acrylate group canreact upon exposure to either ultraviolet or visible light radiationbased on the absorbance of the photoinitiator in the ultraviolet andvisible regions of the electromagnetic spectra.

In the first type of the third monomeric unit of Formula (III), the R₃group comprises an aromatic ketone group. When exposed to ultravioletradiation, the aromatic ketone group can abstract a hydrogen atom fromanother polymeric chain or from another portion of the polymeric chain.This abstraction results in the formation of radicals that cansubsequently combine to form crosslinks between polymeric chains orwithin the same polymeric chain. In many embodiments, the aromaticketone group is an aromatic ketone group such as, for example, aderivative of benzophenone, acetophenone, or anthroquinone. Monomersthat can result in this type of third monomeric unit of Formula (III)include 4-(meth)acryloyloxybenzophenone,4-(meth)acryloyloxyethoxybenzophenone,4-(meth)acryloyloxy-4′-methoxybenzophenone,4-(meth)acryloyloxyethoxy-4′-methoxybenzophenone,4-(meth)acryloyloxy-4′-bromobenzophenone,4-acryloyloxyethoxy-4′-bromobenzophenone, and the like.

In the second type of the third monomeric unit of Formula (III), the R₃group comprises a (meth)acryloyl group. That is, R₃ is a group that canundergo free-radical reaction in the presence of ultraviolet or visiblelight radiation and a photoinitiator. The curable (meth)acrylatecopolymer is typically not prepared directly with this type of thirdmonomeric unit present. Rather, a precursor (meth)acrylate copolymer isinitially prepared and then further reacted with an unsaturated reagentcompound to introduce the pendant (meth)acryloyl group. Typically, theintroduction of the pendant (meth)acryloyl group involves (1) thereaction between a nucleophilic group on the precursor (meth)acrylatecopolymer and an electrophilic group on the unsaturated reagent compound(i.e., the unsaturated reagent compound includes both an electrophilicgroup and a (meth)acryloyl group) or (2) the reaction betweenelectrophilic groups on the precursor (meth)acrylate copolymer and anucleophilic group on the unsaturated reagent compound (i.e., theunsaturated reagent compound includes both a nucleophilic group and a(meth)acryloyl group). These reactions between the nucleophilic groupand electrophilic group typically are ring opening, addition, orcondensation reactions.

In some embodiments of this second type, the precursor (meth)acrylatecopolymer has hydroxy, carboxylic acid (—COOH), or anhydride(—O—(CO)—O—) groups. If the precursor (meth)acrylate copolymer hashydroxy groups, the unsaturated reagent compound often has a carboxylicacid (—COOH), isocyanato (—NCO), epoxy (i.e., oxiranyl), or anhydridegroup in addition to a (meth)acryloyl group. If the precursor(meth)acrylate copolymer has carboxylic acid groups, the unsaturatedreagent compound often has a hydroxy, amino, epoxy, isocyanato,aziridinyl, azetidinyl, or oxazolinyl group in addition to a(meth)acryloyl group. If the precursor (meth)acrylate copolymer hasanhydride groups, the unsaturated reagent compound often has a hydroxyor amine group in addition to a (meth)acryloyl group.

In some examples, the precursor (meth)acrylate copolymer has carboxylicacid groups and the unsaturated reagent compound has an epoxy group.Example unsaturated reagent compounds include, for example, glycidyl(meth)acrylate and 4-hydroxybutyl acrylate glycidyl ether. In otherexamples, the precursor (meth)acrylate copolymer has anhydride groupsand it is reacted with an unsaturated reagent compound that is ahydroxy-substituted alkyl (meth)acrylate such as 2-hydroxyethyl(meth)acrylate, 3-hydroxypropyl (meth)acrylate, or the like. In yetother examples of this second type, the precursor (meth)acrylatecopolymer has hydroxy groups and the unsaturated reagent compound has anisocyanato group and a (meth)acryloyl group. Such unsaturated reagentcompounds include, but are not limited to, isocyanatoalkyl(meth)acrylate such as isocyanatoethyl (meth)acrylate. The use of aprecursor (meth)acrylate copolymer having hydroxy groups may bepreferable in applications where the adhesive is used in articles havingmetal-containing components. Hydroxy groups are less problematic interms of corrosion than acidic groups or anhydride groups.

The second type of R₃ group can be of formula CH₂═CHR₁—(CO)-Q-L- where Lis a linking group and Q is oxy (—O—) or —NH—. The group L includes analkylene, arylene, or combination thereof and can optionally furtherinclude —O—, —O—(CO)—, —NH—(CO)—, —NH—, or a combination thereofdepending on the particular precursor (meth)acrylate copolymer and theparticular unsaturated reagent compound that is reacted to form the(meth)acryloyl-containing R₃ group. In some particular examples, thesecond type of R₃ group is H₂C═CHR₁—(CO)—O—R₆—NH—(CO)—O—R₅—O—(CO)—formed by the reaction of a pendant hydroxy-containing group of formula—(CO)—O—R₅—OH on the precursor (meth)acrylate with a unsaturated reagentcompound that is an isocyanatoalkyl (meth)acrylate of formulaH₂C═CHR₁—(CO)—O—R₆—NCO. Groups R₅ and R₆ are each independently analkylene group such as an alkylene having 1 to 10 carbon atoms, 1 to 6carbon atoms, or 1 to 4 carbon atoms. R₁ is methyl or hydrogen.

The third monomeric unit is typically present in an amount in a range of0.05 to 5 weight percent based on a total weight of the (meth)acrylatecopolymer. If less than 0.05 weight percent is used, the concentrationmay be too low to ensure that adequate curing occurs. For example, theconcentration can be at least 0.1 weight percent, at least 0.2 weightpercent, at least 0.3 weight percent, or at least 0.4 weight percent. Anamount over 5 weight percent, however, may result in decreased adhesiveperformance for an adhesive containing the cured (meth)acrylatecopolymer, and/or increased stress buildup in the articles containingthe cured (meth)acrylate copolymer, and/or delamination of the adhesivefrom the substrates within the articles containing the cured(meth)acrylate copolymer. Also, if the third monomeric units are of thefirst type containing an aromatic ketone group, yellowing can occur inthe adhesive layer when the amount exceeds 5 weight percent or evenlower. For example, the concentration can be up to 4 weight percent, upto 3 weight percent, up to 2 weight percent, up to 1.5 weight percent,up to 1 weight percent, up to 0.8 weight percent, or up to 0.6 weightpercent. In some embodiments, the amount of the third monomeric unit isin a range of 0.1 to 5 weight percent, 0.1 to 4 weight percent, 0.1 to 3weight percent, 0.1 to 2 weight percent, 0.2 to 2 weight percent, 0.2 to1.5 weight percent, 0.2 to 1 weight percent, 0.3 to 5 weight percent,0.3 to 2 weight percent, 0.3 to 1 weight percent, 0.4 to 2 weightpercent, or 0.4 to 1 weight percent. If high optical transmission isdesired, the amount of the third monomeric unit of the first type isoften no greater than 2 weight percent.

The curable (meth)acrylate copolymer optionally can further comprises afourth monomeric unit of Formula (IV) in an amount in a range of 0 to 10weight percent based on the total weight of the curable (meth)acrylatecopolymer.

In Formula (IV), group R₁ is the same as defined above, group X is —O—or —NH—, and group R₄ is a hydroxy-substituted alkyl group orhydroxy-substituted heteroalkyl group. In many embodiments, the R₄ groupis a hydroxy-substituted alkyl group having 1 to 20 carbon atoms or 1 to10 carbon atoms and a single hydroxy group. In other embodiments, the R₄group is a hydroxy-substituted heteroalkyl group having 1 to 20 carbonatoms or 1 to 10 carbon atoms and 1 to 10 heteroatoms, 1 to 6heteroatoms, or 1 to 4 heteroatoms. The heteroatom is often an oxy(—O—).

Suitable monomeric units of Formula (IV) are typically derived fromhydroxy-substituted alkyl (meth)acrylates, hydroxy-substituted alkyl(meth)acrylamides, hydroxy-substituted heteroalkyl (meth)acrylates, andhydroxy-substituted heteroalkyl (meth)acrylamides. Examples ofhydroxy-substituted alkyl (meth)acrylates include, but are not limitedto, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate,3-hydroxypropyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate.Hydroxy substituted-alkyl (meth)acrylamides include, but are not limitedto, 2-hydroxyethyl (meth)acrylamide and 3-hydroxypropyl(meth)acrylamide. Example hydroxy-substituted heteroalkyl(meth)acrylates include hydroxy-terminated alkylene oxide(meth)acrylate, hydroxy-terminated di(alkylene oxide) (meth)acrylate,and hydroxy-terminated poly(alkylene oxide) (meth)acrylate. The alkyleneoxide is typically ethylene oxide or propylene oxide. Specific examplesof hydroxy-terminated poly(alkylene oxide) (meth)acrylates includevarious monomers commercially available from Sartomer (Exton, Pa., USA)under the trade designation CD570, CD571, and CD572 and from Cognis(Germany) under the trade designation BISOMER (e.g., BISOMER PPA 6).

In some embodiments, a precursor (meth)acrylate copolymer is preparedthat contains the fourth monomeric units of Formula (IV). Some or all ofthese monomeric units are then reacted with an unsaturated reagentcompound having an isocyanato group and a (meth)acryloyl group to formthe curable (meth)acrylate copolymer. That is, the resulting curable(meth)acrylate copolymer has pendant (meth)acryloyl groups.

The presence of the fourth monomeric unit is not desirable in someapplications. For example, for use in electronic displays, minimizingthe use of hydroxy-containing monomeric units may be desirable.(Meth)acrylate copolymers with low or no optional fourth monomeric unitmay advantageously have a dielectric constant that is less dependent onthe relative humidity. That is, more hydrophobic (meth)acrylatecopolymers are less likely to absorb water so the dielectric constant isless dependent on the relative humidity. Although it may not bedesirable to have hydroxy-containing monomers in some applications, theuse of the second monomeric units of Formula (II) (i.e., these monomericunits are from (meth)acrylamide) are considered advantageous becausethey contribute to hydrogen bonding while being non-corrosive.

In some embodiments, the optional fourth monomeric unit is present in anamount up to 10 weight percent based on a total weight of the(meth)acrylate copolymer. The presence of the optional fourth monomericunit can increase the dielectric constant of the (meth)acrylatecopolymer. The amount of the fourth monomeric unit can be up to 9 weightpercent, up to 8 weight percent, up to 6 weight percent, or up to 5weight percent. The optional fourth monomeric unit can be absent or canbe present in an amount equal to at least 0.1 weight percent, at least0.5 weight percent, or at least 1 weight percent. For example, theoptional fourth monomer can be present in an amount in a range of 0 to10 weight percent, 1 to 10 weight percent, 0 to 8 weight percent, 1 to 8weight percent, 0 to 5 weight percent, or 1 to 5 weight percent.

The amount of the optional fourth monomeric unit is often lower in thecurable (meth)acrylate and cured (meth)acrylate than in the precursor(meth)acrylate if the third monomeric unit has a (meth)acryloyl group.That is, part of all of the fourth monomeric unit in the precursor(meth)acrylate copolymer may be used to attach the (meth)acryloyl groupby reacting with the unsaturated reagent compound as discussed above.

In addition to the optional fourth monomeric unit of Formula (IV), otheroptional monomeric units (fifth monomeric units) can be present in the(meth)acrylate copolymer. Other optional monomeric units are typicallyselected based on compatibility with the other monomeric units in the(meth)acrylate copolymer. These optional monomeric units may also beused to tune the rheological properties of the (meth)acrylate copolymer,such as for adjusting the glass transition temperature or shear storagemodulus (G′). These optional monomeric units are also typically selectedbased on the final use of the curable and/or cured (meth)acrylatecopolymer. For example, if the curable and/or cured (meth)acrylatecopolymer is used in an electronic display assembly, any optionalmonomeric units are selected so that an optically clear adhesive can beprepared. For example, monomeric units with aromatic groups (at least inamounts that would interfere with optical clarity) might beadvantageously avoided (e.g., styrene).

Example optional monomers (fifth monomers) include, for example,nitrogen-containing monomeric units that are not of Formula (II),(meth)acrylates having an aromatic group (but that is not of Formula(I)), styrene, and styrene-type monomers (e.g., alpha-methyl styrene).

Suitable nitrogen-containing monomeric units that are not of Formula(II) include, for example, monomeric units derived from various N-alkyl(meth)acrylamides and N,N-dialkyl (meth)acrylamides can be included suchas N-methyl (meth)acrylamide, N-ethyl (meth)acrylamide, N,N-dimethyl(meth)acrylamide, and N,N-diethyl (meth)acrylamide, N-isopropyl(meth)acrylamide, and N-octyl (meth)acrylamide. Other monomeric unitsderived from various N,N-dialkylaminoalkyl (meth)acrylates andN,N-dialkylaminoalkyl (meth)acrylamides can be included such as, forexample, N,N-dimethyl aminoethyl (meth)acrylate, N,N-dimethylaminoethyl(meth)acrylamide, N,N-dimethylaminopropyl (meth)acrylate,N,N-dimethylaminopropyl (meth)acrylamide, N,N-diethylaminoethyl(meth)acrylate, N,N-diethylaminoethyl (meth)acrylamide,N,N-diethylaminopropyl (meth)acrylate, and N,N-diethylaminopropyl(meth)acrylamide. Other examples include monomeric units derived fromN-vinyl pyrrolidone, N-morpholino (meth)acrylate, diacetone(meth)acrylamide, and N-vinyl caprolactam.

Other optional monomeric units included are those formed from(meth)acrylates having an aromatic group that are not of Formula (I) orFormula (III). These monomeric units may negatively impact opticalclarity and the amount may need to be controlled for some applications.Example monomers include, but are not limited to, 2-phenoxyethylacrylate (available under the trade designation SR339 from Sartomer(Exton, Pa.)), 2-(phenylthio)ethyl acrylate (available from Cytec Ind.(Woodland, N.J.)), 2-phenylphenoxyethyl acrylate (available from DoubleBond Chemical Ind. Co. (Taipei, Taiwan)), propionic acid(3-phenoxyphenyl)methyl ester (available from Miwon Chemicals Co.(Korea)).

The amount of any other optional monomer or combination of optionalmonomers is typically no greater than 20 weight percent based on a totalweight of the curable (meth)acrylate copolymer. That is, the amount ofthe other optional monomer is no greater than 15 weight percent, nogreater than 10 weight percent, or no greater than 5 weight percent and,if present, equal to at least 1 weight percent, at least 2 weightpercent, or at least 5 weight percent. The amount can be in a range of 0to 20 weight percent, 1 to 20 weight percent, 5 to 20 weight percent, 0to 10 weight percent, 1 to 10 weight percent, 0 to 5 weight percent, or1 to 5 weight percent.

In some embodiments, the curable (meth)acrylate copolymer is free orsubstantially free of monomeric units having acidic groups. For example,the (meth)acrylate copolymer is free or substantially free of monomericunits derived from (i.e., formed from) (meth)acrylic acid. In otherembodiments, the (meth)acrylate copolymer is free or substantially freeof monomeric units that have groups that can be easily hydrolyzed toprovide an acidic group. For example, the (meth)acrylate copolymer isfree or substantially free of monomeric units derived fromanhydride-containing monomers (e.g., maleic anhydride) or vinyl esters(e.g., vinyl acetate). Stated differently, the (meth)acrylate copolymerusually is not derived from acidic monomers or monomers that can behydrolyzed to form acidic groups. In still other embodiments, the(meth)acrylate copolymer is free or substantially free of monomericunits that have aromatic rings other than those of the type-one monomersof Formula (III). For example, the (meth)acrylate copolymer is free orsubstantially free of monomeric units derived from styrene orstyrene-type monomers. As used herein in reference to monomeric unitswithin the (meth)acrylate copolymer, the term “substantially free” meansthat the amount of the monomeric unit is less than 0.5 weight percent,less than 0.2 weight percent, less than 0.1 weight percent, less than0.05 weight percent, or less than 0.01 weight percent based on a totalweight of the (meth)acrylate copolymer.

In addition to the monomers used to form the various monomeric unitsdescribed above, the polymerizable composition used to prepare the(meth)acrylate copolymer typically includes a free radical initiator tocommence polymerization of the monomers. The free radical initiator canbe a photoinitator or a thermal initiator. The amount of the freeradical initiator is often in a range of 0.05 to 5 weight percent basedon a total weight of monomers used.

Suitable thermal initiators include various azo compound such as thosecommercially available under the trade designation VAZO from E. I.DuPont de Nemours Co. (Wilmington, Del., USA) including VAZO 67, whichis 2,2′-azobis(2-methylbutane nitrile), VAZO 64, which is2,2′-azobis(isobutyronitrile), VAZO 52, which is(2,2′-azobis(2,4-dimethylpentanenitrile)) and VAZO 88, which is1,1′-azobis(cyclohexanecarbonitrile); various peroxides such as benzoylperoxide, cyclohexane peroxide, lauroyl peroxide, di-tert-amyl peroxide,tert-butyl peroxy benzoate, di-cumyl peroxide, and peroxidescommercially available from Atofina Chemicals, Inc. (Philadelphia, Pa.)under the trade designation LUPEROX (e.g., LUPEROX 101, which is2,5-bis(tert-butylperoxy)-2,5-dimethylhexane, and LUPEROX 130, which is2,5-dimethyl-2,5-di-(tert-butylperoxy)-3-hexyne); various hydroperoxidessuch as tert-amyl hydroperoxide and tert-butyl hydroperoxide; andmixtures thereof.

In many embodiments, a photoinitiator is used, particularly when thesecond type of monomeric unit of Formula (III) is used. Some exemplaryphotoinitiators are benzoin ethers (e.g., benzoin methyl ether orbenzoin isopropyl ether) or substituted benzoin ethers (e.g., anisoinmethyl ether). Other exemplary photoinitiators are substitutedacetophenones such as 2,2-diethoxyacetophenone or2,2-dimethoxy-2-phenylacetophenone (commercially available under thetrade designation IRGACURE 651 from BASF Corp. (Florham Park, N.J., USA)or under the trade designation ESACURE KB-1 from Sartomer (Exton, Pa.,USA)). Still other exemplary photoinitiators are substitutedalpha-ketols such as 2-methyl-2-hydroxypropiophenone, aromatic sulfonylchlorides such as 2-naphthalenesulfonyl chloride, and photoactive oximessuch as 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime. Othersuitable photoinitiators include, for example, 1-hydroxycyclohexylphenyl ketone (commercially available under the trade designationIRGACURE 184), bis(2,4,6-trimethylbenzoyl)phenylphosphineoxide(commercially available under the trade designation IRGACURE 819),2,4,6-trimethylbenzoylphenylphosphinic acid ethyl ester (commerciallyavailable under the trade designation IRGACURE TPO-L),1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propane-1-one(commercially available under the trade designation IRGACURE 2959),2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone (commerciallyavailable under the trade designation IRGACURE 369),2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one (commerciallyavailable under the trade designation IRGACURE 907), and2-hydroxy-2-methyl-1-phenyl propan-1-one (commercially available underthe trade designation DAROCUR 1173 from Ciba Specialty Chemicals Corp.(Tarrytown, N.Y., USA).

The polymerizable composition may optionally further contain a chaintransfer agent to control the molecular weight of the resultant(meth)acrylate copolymer. Examples of useful chain transfer agentsinclude, but are not limited to, carbon tetrabromide, alcohols (e.g.,ethanol and isopropanol), mercaptans or thiols (e.g., lauryl mercaptan,butyl mercaptan, tert-dodecyl mercaptan, ethanethiol,isooctylthioglycolate, 2-ethylhexyl thioglycolate, 2-ethylhexylmercaptopropionate, ethyleneglycol bisthioglycolate), and mixturesthereof. If used, the polymerizable mixture may include up to 1 weightpercent of a chain transfer agent based on a total weight of monomers.The amount can be up to 0.5 weight percent, up to 0.3 weight percent, upto 0.2 weight percent, or up to 0.1 weight percent and is often equal toat least 0.005 weight percent, at least 0.01 weight percent, at least0.05 weight percent, or at least 0.1 weight percent. For example, thepolymerizable composition can contain 0.005 to 0.5 weight percent, 0.01to 0.5 weight percent, 0.05 to 0.2 weight percent, 0.01 to 0.2 weightpercent, or 0.01 to 0.1 weight percent chain transfer agent based on thetotal weight of monomers.

The polymerizable composition can further include other components suchas, for example, antioxidants and/or stabilizers such as hydroquinonemonomethyl ether (p-methoxyphenol, MeHQ), and those available under thetrade designation IRGANOX 1010(tetrakis(methylene(3,5-di-tert-butyl-4-hydroxyhydrocinnamate))methane)from BASF Corp. (Florham Park, N.J., USA). The antioxidant and/orstabilizer can be used to increase the temperature stability of theresulting (meth)acrylate copolymer. If used, an antioxidant and/orstabilizer is typically used in the range of 0.01 percent by weight(weight percent) to 1.0 weight percent, based on the total weight ofmonomers in the polymerizable composition.

The polymerization of the polymerizable composition can occur in thepresence or absence of an organic solvent. If an organic solvent isincluded in the polymerizable composition, the amount is often selectedto provide the desired viscosity to the polymerizable composition and tothe polymerized composition. Examples of suitable organic solventsinclude, but are not limited to, methanol, tetrahydrofuran, ethanol,isopropanol, heptane, acetone, methyl ethyl ketone, methyl acetate,ethyl acetate, toluene, xylene, and ethylene glycol alkyl ether. Thosesolvents can be used alone or combined as mixtures. In some embodiments,the organic solvent is present in an amount less than 15 weight percent,less than 10 weight percent, less than 8 weight percent, less than 6weight percent, less than 5 weight percent, or less than 2 weightpercent based on the total weight of the polymerizable composition. Ifused, any organic solvent typically is removed at the completion of thepolymerization reaction or during coating. In many embodiments, thepolymerization occurs with little or no organic solvent present. That isthe polymerizable composition is free of organic solvent or contains aminimum amount of organic solvent.

Either the curable (meth)acrylate copolymer or the precursor(meth)acrylate copolymer, depending on the type of monomeric unit ofFormula (III) that is used, can be prepared by any conventionalpolymerization method (such as solution polymerization or emulsionpolymerization) including thermal bulk polymerization under adiabaticconditions, as is disclosed in U.S. Pat. No. 5,637,646 (Ellis) and U.S.Pat. No. 5,986,011 (Ellis et al.). Other methods of preparing eithertype of (meth)acrylate copolymer include the continuous free radicalpolymerization methods described in U.S. Pat. Nos. 4,619,979 and4,843,134 (Kotnour et al.) and the polymerization within a polymericpackage as described in U.S. Pat. No. 5,804,610 (Hamer et al.).

The curable (meth)acrylate copolymer has a weight average molecularweight (M_(w)) that is in a range of 100,000 to 400,000 Daltons (Da).The adhesive may not have a suitable creep compliance at 25° C. and at70° C. if the weight average molecular weight is outside of this range.If the molecular weight is lower than 100,000 Da, the amount of thethird monomeric unit needed to effectively cure the (meth)acrylatecopolymer may be quite high. If the amount of the third monomeric unitis too high, the curing reaction may proceed too rapidly. That is, the(meth)acrylate copolymer may change from having no gel content to havinga very high gel content (and thus a highly elastic cured adhesivecomposition, which may not be desirable in some applications) afterexposure to a very low dose of ultraviolet or visible light radiation.The weight average molecular weight is often at least 150,000 Da, atleast 200,000 Da, or at least 250,000 Da. If the molecular weight isgreater than 400,000 Da, however, the dry curable (meth)acrylatecopolymer may have a viscosity that is too high and a stress-relaxationtime that is too long to effectively flow and cover various features(e.g., ink-steps) on a substrate. The molecular weight can be up to350,000 Da or up to 300,000 Da. In some embodiments, the weight averagemolecular weight is in a range of 100,000 to 350,000 Da, in a range of100,000 to 300,000 Da, in a range of 150,000 to 400,000 Da, or in arange of 200,000 to 400,000 Da. The weight average molecular weight canbe determined by Gel Permeation Chromatography (GPC).

Other monomeric materials having multiple (meth)acryloyl groups can becombined with the curable (meth)acrylate copolymer. These monomers canbe added to adjust the crosslink density of the cured (meth)acrylatecopolymer. That is, these monomers are usually added to the curable(meth)acrylate copolymer after it has been formed. These monomers canreact with pendant (meth)acryloyl groups of the curable (meth)acrylatecopolymers when exposed to ultraviolet or visible light radiation in thepresence of a photoinitiator. If added, the amount of these monomericmaterials is typically in the range of 0 to 30 parts per hundred (pph)based on the weight of the curable (meth)acrylate copolymer. Forexample, the amount can be at least 1 pph, at least 2 pph, or at least 5pph and can be up to 30 pph, up to 25 pph, up to 20 pph, up to 15 pph,or up to 10 pph.

Example monomers with two (meth)acryloyl groups include 1,2-ethanedioldiacrylate, 1,3-propanediol diacrylate, 1,9-nonanediol diacrylate,1,12-dodecanediol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanedioldiacrylate, butylene glycol diacrylate, bisphenol A diacrylate,diethylene glycol diacrylate, triethylene glycol diacrylate,tetraethylene glycol diacrylate, tripropylene glycol diacrylate,polyethylene glycol diacrylate (e.g., commercially available fromSartomer under the trade designation SR-210, SR-252, and SR-603),polypropylene glycol diacrylate, polyethylene/polypropylene copolymerdiacrylate, neopentylglycol hydroxypivalate diacrylate modifiedcaprolactone, and polyurethane diacrylates (e.g., commercially availablefrom Sartomer under the trade designation CN9018 and CN983).

Exemplary monomers with three or four (meth)acryloyl groups include, butare not limited to, trimethylolpropane triacrylate (e.g., commerciallyavailable under the trade designation TMPTA-N from Surface Specialties,Smyrna, GA, and under the trade designation SR-351 from Sartomer, Exton,Pa.), pentaerythritol triacrylate (e.g., commercially available underthe trade designation SR-444 from Sartomer),tris(2-hydroxyethylisocyanurate) triacrylate (commercially availableunder the trade designation SR-368 from Sartomer), a mixture ofpentaerythritol triacrylate and pentaerythritol tetraacrylate (e.g.,commercially available from Surface Specialties under the tradedesignation PETIA with an approximately 1:1 ratio of tetraacrylate totriacrylate, and under the trade designation PETA-K with anapproximately 3:1 ratio of tetraacrylate to triacrylate),pentaerythritol tetraacrylate (e.g., commercially available under thetrade designation SR-295 from Sartomer), di-trimethylolpropanetetraacrylate (e.g., commercially available under the trade designationSR-355 from Sartomer), and ethoxylated pentaerythritol tetraacrylate(e.g., commercially available under the trade designation SR-494 fromSartomer). An exemplary crosslinker with five (meth)acryloyl groupsincludes, but is not limited to, dipentaerythritol pentaacrylate (e.g.,commercially available under the trade designation SR-399 fromSartomer).

The curable (meth)acrylate copolymer is typically tacky (i.e., thecurable (meth)acrylate copolymer is tacky prior to curing withultraviolet or visible light radiation; in many cases, the cured(meth)acrylate copolymer is also tacky). If desired, tackifiers can beadded to the curable (meth)acrylate copolymer (or to a mixture of themonomers prior to formation of the curable (meth)acrylate copolymer).Useful tackifiers include, for example, rosin ester resins, aromatichydrocarbon resins, aliphatic hydrocarbon resins, and terpene resins. Ingeneral, light-colored tackifiers selected from hydrogenated rosinesters, hydrogenated terpenes, or hydrogenated aromatic hydrocarbonresins are preferred.

Low molecular weight (e.g., a weight average molecular weight of 100,000Da or less as determined by gel permeation chromatography (GPC)) andhigh glass transition temperature (e.g., greater than 30° C.) polymersderived from (meth)acrylates can be combined with the (meth)acrylatecopolymer. Suitable low molecular weight polymers are described, forexample, in U.S. Pat. No. 6,783,850 (Takizawa et al.), U.S. Pat. No.6,448,339 (Tomita), U.S. Pat. No. 4,912,169 (Whitmire et al.), and U.S.Pat. No. 6,939,911 (Tosaki et al.). These polymers can function astackifiers.

Plasticizers may also be used to adjust the rheology of the adhesivecomposition. The plasticizers may be non-reactive compounds such asphosphate, adipate, and phthalate esters. Various low glass transitiontemperature (e.g., lower than 0° C.), lower molecular weight (e.g., a Mwless than 100,000 Daltons as determined by GPC) acrylic polymers,prepared similarly to the acrylic tackifiers described above can also beused as plasticizers.

Other optional additives include, for example, antioxidants, UVstabilizers, UV absorbers, pigments, curing agents, and polymeradditives. These other optional additives can be selected, if desired,so that they do not significantly reduce the optical clarity of theadhesive composition.

The curable (meth)acrylate copolymer (or a curable adhesive containingthe curable (meth)acrylate copolymer) can be cured to form a cured(meth)acrylate (or a cured adhesive containing the cured (meth)acrylatecopolymer). Significantly, a curable (meth)acrylate copolymer or thecurable adhesive composition are often in the form of a layer (e.g.,film) that can be stored or transported for later curing by a customer.That is, the hydrogen bonding within the curable (meth)acrylatecopolymer adds cohesive strength to the curable (meth)acrylate copolymer(or to the curable adhesive composition). This cohesive strengthenhances the dimensional stability of the layer and reduces the tendencyto flow if the temperature is close to room temperature or less than 40°C.

The curable (meth)acrylate copolymer and an adhesive compositioncontaining the curable (meth)acrylate copolymer has a creep compliancethat is less than 5(10⁻⁴) inverse Pascals at 25° C. and a creepcompliance that is greater than 1(10⁻³) inverse Pascals at 70° C. priorto curing with ultraviolet or visible light radiation. Creep complianceis measured as described in the Example section using a parallel platerheometer. The amount 5(10⁻⁴) can be written as 5E(−04) and the amount1(10⁻³) can be written as 1E(−03).

Because the creep compliance is less than 5(10⁻⁴) inverse Pascals at 25°C., a film or layer of the curable adhesive composition tends to havedimensional stability during storage and/or transport, provided that thetemperature remains near room temperature. That is, the film or layerdoes not readily flow at 25° C. and has dimensional stability. In someembodiments, the creep compliance is less than 4(10⁻⁴) inverse Pascals,less than 3(10⁻⁴) inverse Pascals, or less than 2(10⁻⁴) inverse Pascalsat 25° C. This low creep compliance at 25° C. means that partialcrosslinking (as a result of partial curing) is not required prior tostorage and/or transport. Partial curing, which can be difficult tocontrol from batch to batch, is not required for dimensional stabilityof the curable adhesive compositions. The low creep compliance at 25° C.allows increased consistency of composition and dimensions from batch tobatch of die-cut layers (e.g., films) produced from the curable adhesivecompositions. In some embodiments, the creep compliance at 25° C. isgreater than 1(10⁻⁵) inverse Pascals or greater than 5(10⁻⁵) inversePascals.

Because the creep compliance is greater than 1(10⁻³) inverse Pascals at70° C., a film or layer of the curable adhesive composition tends tohave sufficient flow at commonly used autoclave temperatures to flow andcover various features that may be present on a surface of the substrateto which the film or layer is laminated. In some embodiments, the creepcompliance is greater than 2(10⁻³) inverse Pascals, greater than 3(10⁻³)inverse Pascals, greater than 5(10⁻³) inverse Pascals, or greater than1(10⁻²) inverse Pascals at 70° C. If the creep compliance is too high,there can be issues with boundary control during the assembly of thedisplay (e.g., the adhesive may flow too much under lamination orautoclave conditions). The amount of flow, however, can often becontrolled by simply lowering the lamination or autoclave temperature.

Typically, the layer (e.g., film) of curable adhesive composition canflow sufficiently at temperatures in a range of 40° C. to 80° C., whichis a typical autoclave temperature range used in the formation ofelectronic display assemblies, to cover features on a substrate having aheight that is equal to 30 to 100 percent of the thickness of the film.For example, the features can have a height that is equal to at least 40percent, at least 50 percent, at least 60 percent, at least 70 percent,at least 80 percent, or at least 90 percent of the thickness of the filmof curable adhesive composition. If used in an electronic displayassembly, the feature often is an ink-step, which can have a height upto 100 micrometers or more, up to 80 micrometers, up to 70 micrometers,up to 60 micrometers, up to 40 micrometers, up to 20 micrometers, or upto 10 micrometers.

The adhesive composition (i.e., the curable adhesive composition priorto curing with ultraviolet or visible light radiation) has a shearstorage modulus equal to at least 40 kPa when measured at 25° C. and afrequency of 1 radian/second (rad/sec). If the shear storage modulus isless than 40 kPa, the adhesive may flow upon aging at room temperaturefor about one week. Such adhesive may not have the desired dimensionalstability needed for some applications. The shear storage modulus isoften at least 60 kPa or at least 70 kPa. The shear storage modulus isno greater than 300 kPa (this is often the upper limit for apressure-sensitive adhesive but heat activated adhesives can be highersuch as up to 400 kPa, up to 500 kPa, or up to 600 kPa) but is often nogreater than 200 kPa, no greater than 150 kPa, or no greater than 135kPa. In some embodiments, the shear storage modulus is in a range of 40to 200 kPa, in a range of 40 to 150 kPa, in a range of 40 to 125 Pa, orin a range of 50 to 125 kPa.

The curable (meth)acrylate copolymer and/or the associated curableadhesive compositions combine the properties of high flowability neededduring processing (e.g., lamination and autoclave steps typicallycarried out at elevated temperature such as 40° C. to 80° C.), and thedimensional stability and the cohesive strength needed for storageand/or transport to the end user (typically at temperatures in a rangeof about room temperature to less than 40° C.). The cohesive strengthallows for good converting (e.g., slitting or die cutting)characteristics and film-like behavior at room temperature whileretaining highly viscous character (and thus low elasticity and shortstress relaxation times) at elevated temperature. Advantageously, theadhesive compositions can have good dimensional stability when stored atroom temperature and do not require refrigeration to maintaindimensional stability.

In another aspect, an article is provided that includes a firstsubstrate and a layer of the curable adhesive composition adjacent tothe first substrate. The layer of the curable adhesive composition isoften in the form of a film. As used herein, the term “adjacent” can beused to refer to two materials, typically in the form of layers, thatare in direct contact or that are separated by one or more othermaterials, such as primer or hard coating layers. Often, adjacentmaterials are in direct contact.

Various methods can be used to form the article. For example, anadhesive composition containing a curable (meth)acrylate copolymer, anoptional photoinitiator, and any other optional additives can be coatedout of a solvent or from a melt. Such methods are well known to those ofskill in the art. If processed out of a coating composition thatincludes a solvent, a suitable solvent is one that is miscible with theother components of the coating composition. By this, it is meant thatthe coating composition remains homogeneous in diluted form and duringdrying such that there is no premature separation of the components outof the solvent. A suitable solvent, if used, is one that can be removedeasily from the coated layer. Also, a suitable solvent is one that doesnot damage the substrate to which the coating composition is applied(for example, it cannot cause crazing of a polymer film). Exemplarysolvents include methyl ethyl ketone, methyl isobutyl ketone,1-methoxy-2-propanol, isopropyl alcohol, toluene, ethyl acetate, butylacetate, acetone, and the like, and mixtures thereof.

In many embodiments, the article includes a first substrate, a secondsubstrate, and a layer of the curable adhesive composition positionedbetween the first substrate and the second substrate. The curable(meth)acrylate copolymer within the curable adhesive composition can betransformed to a cured (meth)acrylate copolymer. The method of curingthe curable (meth)acrylate copolymer is dependent on the type of thirdmonomeric unit of Formula (III) used. If the third monomeric unit ofFormula (III) is of the first type (having an aromatic ketone group thatcan undergo hydrogen-abstraction reactions), curing can occur byexposing the curable (meth)acrylate copolymer or curable adhesivecomposition to ultraviolet radiation. If the third monomeric unit ofFormula (III) is of the second type (having a pendant (meth)acryloylgroup), the adhesive composition includes a mixture of the curable(meth)acrylate copolymer and a photoinitator. Curing occurs by exposingthe mixture to ultraviolet or visible light radiation.

Any of the photoinitiators discussed above can be used for curing thecurable (meth)acrylate copolymer having the second type of thirdmonomeric unit. Specific examples include, but are not limited to, thoseavailable under the trade designations IRGACURE 651 from BASF Corp.(Tarrytown, N.Y.), which is 2,2-dimethoxy-2-phenylacetophenone, IRGACURETPO-L from BASF Corp., and IRGACURE 184 from BASF Corp., which is1-hydroxycyclohexyl phenyl ketone.

In some embodiments of the article, the layer of the curable adhesivecomposition is a die-cut layer. More particularly, the article caninclude a die-cut layer positioned between a first substrate and asecond substrate. In some specific articles, at least one of the firstsubstrate and the second substrate is a release liner. For example, insome articles, the die-cut layer is positioned between a first releaseliner and a second release liner. In some other specific articles, thefirst substrate is a release liner and the second substrate is anoptical substrate (e.g., an optical film).

In another aspect, a method of preparing an article is provided. Themethod includes providing a first substrate, a second substrate, and acurable adhesive composition layer. The method further includes forminga laminate comprising the first substrate, the second substrate, and thecurable adhesive composition layer, wherein the adhesive compositionlayer is positioned between the first substrate and the secondsubstrate. Still further, the method includes exposing the adhesivecomposition layer to ultraviolet or visible light radiation to cure the(meth)acrylate copolymer.

The curable adhesive compositions are suitable for electronic displayassemblies because of their combined good handling and flowcharacteristics during processing. These characteristics help manage theamount of Mura and contribute to the ability to cover relatively largeink-steps with minimal risk of bubble formation. Mura often indicatesthe presence of optical defects (e.g., patterns or creases, orbrightness or image unevenness due to cell-gap distortion of an LCD)introduced during the lamination process.

The curable adhesive composition can be exposed to ultraviolet orvisible light radiation while positioned between the first substrate andthe second substrate to form a cured adhesive composition that islaminated to both the first substrate and the second substrate. Curingcan occur at room temperature or at an elevated temperature. In someembodiments, the curing temperature is selected to be at least 20° C.higher than the glass transition temperature of the (meth)acrylatecopolymer. The elevated temperature can enhance mobility of thematerials and curing efficiency. The laminate is often formed at atemperature equal to at least 40° C. such as, for example, in a range of40° C. to 80° C. or in the range of 50° C. to 70° C.

The curable adhesive compositions can be laminated to substrates havingfeatures and can conform to the features. During lamination, theadhesive can flow to cover features that may project from the base ofthe substrate. The adhesive composition can often flow to cover allouter surfaces of features that have a height that is up to 100 percentof the thickness of the adhesive composition. In some embodiments, theadhesive composition is in the form of a layer that is cut (e.g.,die-cut) to have dimensions suitable for positioning between the firstsubstrate and the second substrate.

When an adhesive is laminated between a printed lens (i.e., the lens hasprinted ink-steps) and a second display substrate, the curable adhesivecomposition may need to conform to a large ink-step (i.e., 20-100 or50-100 micrometers or even higher) with the total adhesive thicknessbeing 50-250 micrometers (or less). Completely wetting this largeink-step during initial assembly is very important, because any trappedair bubbles may become very difficult to remove in the subsequentdisplay assembly steps.

Further, the curable composition often has a low shear storage modulus,G′, at lamination temperature (e.g., at a temperature in a range of 40°C. to 80° C.), that is less than 10⁵ Pascal (Pa) (100 kPa) when measuredat 1 radian/second frequency. This low shear storage modulus tends tofavor good ink wetting, as well as quick deformation and compliance tothe sharp edge of the ink-step contour. A suitable adhesive should alsohave sufficient flow to wet the ink surface. Sufficient flow oftencorrelates with a high tan delta value over a broad range of processtemperatures, including lamination and autoclaving (e.g., tan 6 of atleast 0.6 (measured by DMA) between 40° C. to 80° C. or even slightlyhigher).

In certain embodiments, the adhesive compositions containing the curableand/or cured (meth)acrylate copolymer are optically clear. Thus, certainarticles can be laminates that include an optically clear substrate(e.g., an optical substrate such as an optical film) and an opticallyclear adhesive layer of the cured or curable adhesive compositionadjacent to at least one major surface of the optically clear substrate.The laminates can further include a second substrate permanently ortemporarily attached to the adhesive layer and with the adhesive layerbeing positioned between the optically clear substrate and the secondsubstrate.

In some example laminates, an optically clear adhesive layer (i.e., acured or curable adhesive composition described herein) is positionedbetween two substrates and at least one of the substrates is an opticalfilm, a display unit, a touch sensor, or a lens. Optical filmsintentionally enhance, manipulate, control, maintain, transmit, reflect,refract, absorb, retard, or otherwise alter light that impinges upon asurface of the optical film. Optical films included in the laminatesinclude classes of material that have optical functions, such aspolarizers, interference polarizers, reflective polarizers, diffusers,colored optical films, mirrors, louvered optical film, light controlfilms, transparent sheets, brightness enhancement film, anti-glare, andanti-reflective films, and the like. Optical films for the providedlaminates can also include retarder plates such as quarter-wave andhalf-wave phase retardation optical elements. Other optically clearfilms can include anti-splinter films and electromagnetic interferencefilters. The films may also be used as substrates for ITO (i.e., indiumtin oxide) coating or patterning, such as use those used for thefabrication of touch sensors.

In some embodiments, laminates that include a curable or cured adhesiveas describe herein can be optical elements, or can be used to prepareoptical elements. As used herein, the term “optical element” refers toan article that has an optical effect or optical application. Theoptical elements can be used, for example, in electronic displays (e.g.,liquid crystal displays (LCDs), organic light emitting displays (OLEDs),architectural applications, transportation applications, projectionapplications, photonics applications, and graphics applications).Suitable optical elements include, but are not limited to, glazing(e.g., windows and windshields), screens or displays, polarizing beamsplitters, cathode ray tubes, ITO-coated touch sensors such as thoseusing glass or clear plastic substrates, and reflectors.

In addition to various optics-related applications and/or electronicdisplay assembly applications, both the curable and cured adhesivecompositions can be used in a variety of other applications. Forexample, an article can be formed by forming a layer (e.g., film) of acurable adhesive composition on a backing or release liner. If a releaseliner is used, the layer can be transferred to another substrate. Theother substrate can be, for example, a component of an electronicdisplay assembly. That is, the layer can be laminated to anothersubstrate. The film is often laminated between a first substrate and asecond substrate (i.e the layer of curable adhesive is positionedbetween the first substrate and the second substrate).

In some examples, the adhesive compositions can be used in a variety oftransfer tapes. The transfer tapes can be made by coating a curableadhesive composition on a differential release liner (i.e., adouble-sided release liner where both major surfaces of the linercontain a release coating and the release coatings are different) andoptionally can be at least partially cured. The adhesive composition istypically coated onto the side of the liner with the higher releasevalue. After coating, the adhesive-coated release liner is wound into aroll to yield the transfer adhesive. Alternatively, the adhesivecomposition is coated on a first liner and, if needed, dried. A secondliner, which usually has a different release value than the first liner,is positioned adjacent to the adhesive opposite the first liner (the PSAis positioned between the first liner and the second liner). Whenunwinding the adhesive transfer tape, the adhesive remains attached tothe side of the liner with the higher release value. In use, thetransfer adhesive is unwound and laminated to a substrate surface (e.g.,such as those in optics-related devices as disclosed in greater detailbelow, or non-optics-related devices and articles such as paintedpanels, metal panels, window glass, automotive panels, etc.). Thetransfer adhesive has higher adhesion to the substrate surface than tothe release liner and thus is transferred from the release liner to thesubstrate surface.

Turning to the figures, FIG. 1 depicts a cross-sectional view of anexemplary article 10 having a first substrate 12. Disposed on a firstsurface 12 a of the substrate is an inorganic electro-conductive trace14. The trace forms a grid or pattern on the first surface 12 a. Thetrace does not completely cover the first surface 12 a. That is, thereare regions of the first substrate 12 a exposed. The edges of the traceend at electrical connector pads 16.

Exemplary materials of substrate 12 include glass, polyethyleneterephthalate, cyclo-olefin copolymer, polycarbonate, cellulosetriacetate, poly(methyl methacrylate), or another polyacrylate. Incertain embodiments, the substrate is, or is part of, a lens, a touchsensor, a light emissive display, a light reflective display, or apolarizer film, for example.

Exemplary materials used to produce the inorganic electro-conductivetrace 14 include silver, indium tin oxide, doped ZnO, and antimony tinoxide. These electro-conductive traces may also be made from silver orsilver nano-wires. The electro-conductive traces can be contacted withother electro-conductive traces such as circuits prepared from copper orsilver. These circuits, at least in some articles, can also be in directcontact with the adhesive.

As shown in FIG. 1, an adhesive 18 of the present disclosure is adjacentto the trace 14. Because the trace is in a grid format, a portion of theadhesive 18 may be in direct contact with the first surface 12 a of thefirst substrate 12. The adhesive 18 is typically disposed in a layer, onat least a portion of the surface 12 a of the substrate 12 and theinorganic electro-conductive trace 14. The thickness of the adhesivelayer 18 is sufficient to completely cover the trace. The thickness maynot be uniform across its entire surface, as there may be depressions orvalleys between the traces.

Although not shown in FIG. 1, in certain embodiments, the inorganicelectro-conductive trace may have a thin barrier (protective) layerdisposed thereon (not shown), in which case the adhesive 18 will notdirectly contact the trace. Such protective material may includesputtered silicon dioxide or silicon carbide, or a highly cured acrylateor epoxy based hard coating.

Optionally, the embodiment includes a second substrate 11 disposed onthe adhesive 18. In certain embodiments, the first substrate and secondsubstrate, if used, are optical substrates.

Exemplary optical substrates include (or are included as a part of) adisplay panel, such as a liquid crystal display, an OLED display, atouch panel, an electrophoretic display, an electrowetting display or acathode ray tube, a window or glazing, an optical component such as areflector, polarizer, diffraction grating, mirror, or cover lens, oranother film such as a decorative film or optical film. In someembodiments, the optical substrates can be optically clear.

Representative examples of optically clear substrates include glass andpolymeric substrates including those that contain polycarbonates,polyesters (e.g., polyethylene terephthalates and polyethylenenaphthalates), polyimides, polyurethanes, poly(meth)acrylates (e.g.,poly(methyl methacrylates)), polyvinyl alcohols, polyolefins (e.g.,polyethylenes, polypropylenes, and cyclic olefin copolymers), andcellulose triacetates. Typically, cover lenses can be made of glass,poly(methyl methacrylates), or polycarbonate.

FIG. 2 depicts a schematic view of an exemplary process of making anarticle of FIG. 1, The process includes a step of providing a firstsubstrate 22 having a first surface 22 a. An inorganicelectro-conductive trace 24 with electrical connector pads 26 isdisposed on the first surface 22 a. A roll of transfer tape 30 isprovided. The roll of transfer tape 30 includes an adhesive 38 of thedisclosure coated on a liner 31, Optionally, the liner 31 includesrelease coatings allowing for the roll of tape to unwind. The transfertape 30 is laminated to the first substrate 22 such that the adhesive 38is in contact with the trace 24. Because the trace 24 does notcompletely cover the first surface 22 a of the first substrate 22, theadhesive 38 is also in contact with the first surface 22 a.

Typically, the liner 31 is removed and discarded and a second substratecan be laminated onto the adhesive 38. The second substrate (not shownin FIG. 2, and analogous to 11 in FIG. 1), if used, is typicallyoptically clear. Examples of optically clear substrates are describedherein. Upon lamination of the two substrates, a bond is typicallyformed without an air gap.

In certain embodiments, after applying the laminate, the adhesive 38 canbe exposed to an energy source (e.g., a source of ultraviolet or visiblelight radiation) to cure the (meth)acrylate copolymer by reacting the R₃group of the monomeric units of Formula (III) and by building themolecular weight. The cured (meth)acrylate copolymer is a durablepolymeric network having a higher cohesive strength and higher viscositycompared to the curable (meth)acrylate copolymer. However, even thecured adhesive is not so highly crosslinked that the material is brittleor friable at room temperature.

While FIG. 2 depicts the use of a transfer tape, the method can also bepracticed using cut sheets or die-cut films made from a transfer tape,for example. Also, in certain embodiments, the adhesive 38 can alsoinclude a second protective liner disposed thereon (not shown) on thesurface opposite the liner 31.

Suitable liners include flexible backing materials conventionally usedas a tape backing, optical film, or release liner. In general, anysuitable flexible material can be used without specific limitations onits refractive index or optical clarity since it is removed and does notbecome part of the article that includes the display substrate. Typicalexamples of flexible backing materials used as tape backings that may beuseful for the laminates described herein include those made of paperKraft paper) or polymeric films such as polypropylene, polyethylene,polyurethane, polyester (e.g., polyethylene terephthalate), ethylenevinyl acetate, cellulose acetate, and ethyl cellulose. Some flexiblebackings may have coatings. For example a release liner may be coatedwith a low adhesion component, such as a silicone-containing material ora fluorocarbon-containing material.

Various embodiments are provided that are adhesive compositions,articles containing the adhesive composition, and methods of making thearticles.

Embodiment 1A is a curable adhesive composition that contains (1) acurable (meth)acrylate copolymer having a weight average molecularweight (Mw) in a range of 100,000 to 400,000 Daltons (Da) and (2) anoptional photoinitiator. The curable (meth)acrylate copolymer includes afirst monomeric unit of Formula (I) in an amount in a range of 50 to 94weight percent based on a total weight of monomeric units in the curable(meth)acrylate copolymer.

In Formula (I), R₁ is hydrogen or methyl and R₂ is an alkyl,heteroalkyl, aryl, aralkyl, or alkaryl group. The curable (meth)acrylatecopolymer further includes a second monomeric unit of Formula (II) in anamount in a range of 6 to 10 weight percent based on the total weight ofmonomeric units in the curable (meth)acrylate copolymer.

Group R₁ is the same as defined above for Formula (I). The curable(meth)acrylate copolymer still further comprises a third monomeric unitof Formula (III) in an amount in a range of 0.05 to 5 weight percentbased on the total weight of monomeric units of the curable(meth)acrylate copolymer.

In Formula (III), group R₁ is the same as defined above and group R₃comprises 1) an aromatic ketone group that causes hydrogen abstractionfrom a polymeric chain when exposed to ultraviolet radiation or 2) a(meth)acryloyl group that undergoes free radical polymerization whenexposed to ultraviolet or visible light radiation in the presence of thephotoinitiator. The curable (meth)acrylate copolymer yet furthercomprises an optional fourth monomeric unit of Formula (IV) in an amountin a range of 0 to 20 weight percent based on the total weight ofmonomeric units of the curable (meth)acrylate copolymer.

In Formula (IV), group R₁ is the same as defined above, group X is —O—or —NH—, and group R₄ is a hydroxy-substituted alkyl orhydroxy-substituted heteroalkyl. The asterisk (*) in the variousformulas indicates a site of attachment to another monomeric unit or aterminal group. The curable adhesive composition prior to curing has acreep compliance that is less than 5(10⁻⁴) inverse Pascals at 25° C. anda creep compliance that is greater than 1(10⁻³) inverse Pascals at 70°C. The curable adhesive composition has a shear storage modulus equal toat least 40 kiloPascals (kPa) when measured at 25° C. and 1radian/second.

Embodiment 2A is the curable adhesive composition of embodiment 1A,wherein R₂ is an alkyl or heteroalkyl group.

Embodiment 3A is the curable adhesive composition of embodiment 1A or2A, wherein R₂ is an alkyl that is linear, branched, cyclic, or acombination thereof.

Embodiment 4A is the curable adhesive composition of any one ofembodiments 1A to 3A, wherein the curable (meth)acrylate copolymercomprises 7 to 10 weight percent of the second monomeric unit of Formula(II).

Embodiment 5A is the curable adhesive composition of any one ofembodiments 1A to 4A, wherein the third monomeric unit is derived from a(meth)acrylate monomer having an aromatic ketone group.

Embodiment 6A is the curable adhesive composition of embodiment 5A,wherein the (meth)acrylate monomer having an aromatic ketone group isselected from 4-(meth)acryloyloxybenzophenone,4-(meth)acryloyloxyethoxybenzophenone,4-(meth)acryloyloxy-4′-methoxybenzophenone,4-(meth)acryloyloxyethoxy-4′-methoxybenzophenone,4-(meth)acryloyloxy-4′-bromobenzophenone, or4-acryloyloxyethoxy-4′-bromobenzophenone.

Embodiment 7A is the curable adhesive composition of any one ofembodiments 1A to 6A, wherein the third monomeric unit has a(meth)acryloyl group that undergoes free radical polymerization whenexposed to ultraviolet or visible light radiation in the presence of thephotoinitiator.

Embodiment 8A is the curable adhesive composition of any one ofembodiments 1A to 7A, wherein the amount of the third monomeric unit isin a range of 0.05 to 5 weight percent based on the total weight of the(meth)acrylate copolymer.

Embodiment 9A is the curable adhesive composition of any one ofembodiments 1A to 8A, wherein the curable (meth)acrylate copolymerfurther comprises a fifth monomeric unit derived from anitrogen-containing monomer other than (meth)acrylamide.

Embodiment 10A is the curable adhesive composition of any one ofembodiments 1A to 9A, wherein the curable (meth)acrylate copolymer isfree or substantially free of monomeric units derived from an acidicmonomer, from an anhydride-containing monomer, or from a vinyl estermonomer.

Embodiment 11A is the curable adhesive composition of any one ofembodiments 1A to 10A, wherein the curable (meth)acrylate copolymer isfree or substantially free of monomeric units derived from styrene orstyrene-type monomer.

Embodiment 12A is the curable adhesive composition of any oneembodiments 1A to 11A, wherein the curable adhesive composition furthercomprises a monomer having multiple (meth)acryloyl groups.

Embodiment 13A is the curable adhesive composition of any one ofembodiments 1A to 12A, wherein the curable (meth)acrylate copolymer hasa glass transition temperature equal to at least −15° C. when measuredusing Dynamic Mechanical Analysis at a frequency of 1 radian/second.

Embodiment 14A is the curable adhesive composition of any one ofembodiments 1A to 13A, wherein the curable adhesive composition is apressure-sensitive adhesive composition. Embodiment 1B is a curedadhesive composition comprising a cured (meth)acrylate copolymer, thecured adhesive composition being a reaction product resulting fromexposing a curable adhesive composition to ultraviolet or visible lightradiation. The curable adhesive composition comprises (1) a curable(meth)acrylate copolymer having a weight average molecular weight (Mw)in a range of 100,000 to 400,000 Daltons (Da) and (2) an optionalphotoinitiator. The curable (meth)acrylate copolymer includes a firstmonomeric unit of Formula (I) in an amount in a range of 50 to 94 weightpercent based on a total weight of monomeric units in the curable(meth)acrylate copolymer.

In Formula (I), R₁ is hydrogen or methyl and R₂ is an alkyl,heteroalkyl, aryl, aralkyl, or alkaryl group. The curable (meth)acrylatecopolymer further includes a second monomeric unit of Formula (II) in anamount in a range of 6 to 10 weight percent based on the total weight ofmonomeric units in the curable (meth)acrylate copolymer.

Group R₁ is the same as defined above for Formula (I). The curable(meth)acrylate copolymer still further comprises a third monomeric unitof Formula (III) in an amount in a range of 0.05 to 5 weight percentbased on the total weight of monomeric units of the curable(meth)acrylate copolymer.

In Formula (III), group R₁ is the same as defined above and group R₃comprises 1) an aromatic ketone group that causes hydrogen abstractionfrom a polymeric chain when exposed to ultraviolet radiation or 2) a(meth)acryloyl group that undergoes free radical polymerization whenexposed to ultraviolet or visible light radiation in the presence of thephotoinitiator. The curable (meth)acrylate copolymer yet furthercomprises an optional fourth monomeric unit of Formula (IV) in an amountin a range of 0 to 20 weight percent based on the total weight ofmonomeric units of the curable (meth)acrylate copolymer.

In Formula (IV), group R₁ is the same as defined above, group X is —O—or —NH—, and group R₄ is a hydroxy-substituted alkyl orhydroxy-substituted heteroalkyl. The asterisk (*) in the variousformulas indicates a site of attachment to another monomeric unit or aterminal group. The curable adhesive composition prior to curing has acreep compliance that is less than 5(10⁻⁴) inverse Pascals at 25° C. anda creep compliance that is greater than 1(10⁻³) inverse Pascals at 70°C. The curable adhesive composition has a shear storage modulus equal toat least 40 kiloPascals (kPa) when measured at 25° C. and 1radian/second.

Embodiment 2B is the cured adhesive composition of embodiment 1B,wherein the adhesive composition is optically clear.

Embodiment 3B is the cured adhesive composition of embodiment 1B or 2B,wherein R₂ is an alkyl or heteroalkyl group.

Embodiment 4B is the cured adhesive composition of any one of embodiment1B to 3B, wherein R₂ is an alkyl that is linear, branched, cyclic, or acombination thereof.

Embodiment 5B is the cured adhesive composition of any one ofembodiments 1B to 4B, wherein the curable (meth)acrylate copolymercomprises 7 to 10 weight percent of the second monomeric unit of Formula(II).

Embodiment 6B is the cured adhesive composition of any one ofembodiments 1B to 5B, wherein the third monomeric unit is derived from a(meth)acrylate monomer having an aromatic ketone group.

Embodiment 7B is the cured adhesive composition of embodiment 6B,wherein the (meth)acrylate monomer having an aromatic ketone group isselected from 4-(meth)acryloyloxybenzophenone,4-(meth)acryloyloxyethoxybenzophenone,4-(meth)acryloyloxy-4′-methoxybenzophenone,4-(meth)acryloyloxyethoxy-4′-methoxybenzophenone,4-(meth)acryloyloxy-4′-bromobenzophenone, or4-acryloyloxyethoxy-4′-bromobenzophenone.

Embodiment 8B is the cured adhesive composition of any one ofembodiments 1B to 7B, wherein the third monomeric unit has a(meth)acryloyl group that undergoes free radical polymerization whenexposed to ultraviolet or visible light radiation in the presence of thephotoinitiator.

Embodiment 9B is the cured adhesive composition of any one ofembodiments 1B to 8B, wherein the amount of the third monomeric unit isin a range of 0.05 to 5 weight percent based on the total weight of the(meth)acrylate copolymer.

Embodiment 10B is the cured adhesive composition of any one ofembodiments 1B to 9B, wherein the curable (meth)acrylate copolymerfurther comprises a nitrogen-containing monomer other than(meth)acrylamide (not of Formula (II)), a (meth)acrylate having anaromatic group (not of Formula (I)).

Embodiment 11B is the cured adhesive composition of any one ofembodiments 1B to 10B, wherein the curable (meth)acrylate copolymerfurther comprises a fifth monomeric unit derived from anitrogen-containing monomer other than (meth)acrylamide.

Embodiment 12B is the cured adhesive composition of any one ofembodiments 1B to 11B, wherein the curable (meth)acrylate copolymer isfree or substantially free of monomeric units derived from an acidicmonomer, from an anhydride-containing monomer, or from a vinyl estermonomer.

Embodiment 13B is the cured adhesive composition of any one ofembodiments 1B to 12B, wherein the cured (meth)acrylate is formed from acurable adhesive composition comprising the curable (meth)acrylatecopolymer, a photoinitiator, and a monomer having multiple(meth)acryloyl groups.

Embodiment 14B is the cured adhesive composition of any one ofembodiments 1B to 13B, wherein the curable (meth)acrylate copolymer hasa glass transition temperature equal to at least −15° C. when measuredusing Dynamic Mechanical Analysis at a frequency of 1 radian/second.

Embodiment 15B is the cured adhesive composition of any one ofembodiments 1B to 14B, wherein the cured adhesive composition is apressure-sensitive adhesive composition.

Embodiment 1C is an article comprising a first substrate and a layer ofthe curable adhesive composition of any one of embodiment 1A to 14A or alayer of the cured adhesive composition of any one of embodiment 1B to15B positioned adjacent to the first substrate.

Embodiment 2C is the article of embodiment 1C, further comprising asecond substrate, wherein the layer of the curable adhesive compositionor the layer of the cured adhesive composition is positioned between thefirst substrate and the second substrate.

Embodiment 3C is the article of embodiment 1C or 2C, wherein at leastone of the first substrate and the second substrate has at least onefeature with a height in a range of 30 to 100 percent of a thickness ofthe layer of curable adhesive composition or the layer of the curedadhesive composition and wherein the layer of the curable adhesivecomposition or the layer of the cured adhesive composition covers anouter surfaces of the feature.

Embodiment 4C is the article of any one of embodiments 1C to 3C, whereinat least one of the first substrate or second substrate is an opticalfilm, display unit, touch sensor, or lens.

Embodiment 5C is the article of any one of embodiments 1C to 4C, whereinthe layer of the curable adhesive composition is a die-cut film.

Embodiment 6C is the article of any one of embodiments 1C to 5C, whereinthe layer of curable adhesive composition is a die cut film and whereinthe die cut film is adjacent to the first substrate that is a releaseliner.

Embodiment 7C is the article of embodiment 6C, wherein die cut film ispositioned between the first substrate that is a release liner and asecond substrate that is a release liner.

Embodiment 8C is the article of embodiment 6C, wherein die cut film ispositioned between the first substrate that is a release liner and asecond substrate that is an optical substrate.

Embodiment 9C is the article of embodiment 8C, wherein the secondsubstrate is an optical film.

Embodiment 10C is the article of any one of embodiments 1C to 9C,wherein the curable adhesive composition or the cured adhesivecomposition is a pressure-sensitive adhesive composition.

Embodiment 1D is a method of preparing an article. The method includesproviding a first substrate, a second substrate, and a layer of acurable adhesive composition of any one of embodiments 1A to 14A. Themethod further includes forming a laminate comprising the firstsubstrate, the second substrate, and the layer of the curable adhesivecomposition, wherein the layer of the curable adhesive composition ispositioned between the first substrate and the second substrate. Themethod yet further includes exposing the layer of the curable adhesivecomposition to ultraviolet or visible light radiation to cure thecurable (meth)acrylate copolymer and form a layer of a cured adhesivecomposition. That is, the curable (meth)acrylate copolymer within thecurable adhesive composition is reacted to form a cured (meth)acrylatecopolymer.

Embodiment 2D is the method of embodiment 1D, wherein the cured adhesivecomposition is optically clear.

Embodiment 3D is the method of embodiments 1D or 2D, wherein the curable(meth)acrylate copolymer has a glass transition temperature equal to atleast −15° C. when measured using Dynamic Mechanical Analysis at afrequency of 1 radian/second.

Embodiment 4D is the article of embodiment 1D to 3D, wherein at leastone of the first substrate and the second substrate has at least onefeature with a height in a range of 30 to 100 percent of a thickness ofthe layer of the curable adhesive composition and wherein the adhesivecomposition covers an outer surfaces of the feature.

Embodiment 5D is the method of any one of embodiments 1D to 4D, whereinat least one of the first substrate or second substrate is an opticalfilm, display unit, touch sensor, or lens.

Embodiment 6D is the method of any one of embodiments 1D to 5D, whereinforming a laminate occurs at a temperature equal to at least 40° C.

Embodiment 7D is the method of any one of embodiments 1D to 6D, whereinat least one of the first substrate and the second substrate has atleast one feature and wherein forming the laminate comprises flowing thecurable adhesive composition to cover an outer surface of the feature.

Embodiment 8D is the method of any one of embodiments 1D to 7D, whereinthe curable adhesive composition layer is cut with a die to havedimensions suitable for positioning between the first substrate and thesecond substrate.

Embodiment 9D is the method of any one of embodiments 1D to 8D, whereinthe curable adhesive composition and/or the cured adhesive compositionis a pressure-sensitive adhesive composition.

EXAMPLES

Objects and advantages of this disclosure are further illustrated by thefollowing examples, but the particular materials and amounts thereofrecited in these examples, as well as other conditions and details,should not be construed to unduly limit this disclosure.

TABLE 1 Materials Acronym Description Supplier nBA n-Butyl acrylate, amonomer BASF Corporation (Florham Park, NJ, USA) HA n-Hexyl acrylate, amonomer Sigma-Aldrich (St. Louis, MO, USA) CHA Cyclohexyl acrylate, amonomer Sigma-Aldrich (St. Louis, MO, USA) 2-OA 2-Octyl acrylate, amonomer 3M (St. Paul, MN, USA) 2-EHA 2-Ethylhexyl acrylate, a monomerSigma-Aldrich (St. Louis, MO, USA) 2-EHMA 2-Ethylhexyl methacrylate, amonomer Sigma-Aldrich (St. Louis, MO, USA) IBOA Isobornyl acrylate, amonomer Sigma-Aldrich (St. Louis, MO, USA) ISTA Isosteryl Acrylate, amonomer Shin Nakamura Chemical Co. (Wakayama, JP) HEA Hydroxyethylacrylate, a monomer Kowa American Corporation (New York, NY, USA) HPAHydroxypropyl acrylate, a monomer Tokyo Chemical Industry Co., LTD (TCI)(Tokyo, Japan) Acm Acrylamide, a monomer Zibo Xinye Chemical Co., LTD(Zibo City, Shandong Province, China) ABP Acryloyl benzophenone,Prepared using a method a copolymerizable monomer containing a similarto that described in separately photoreactive group Temel et al.,Journal of Photochemistry and Photobiology A: Chemistry, 219, 26-31(2011) AeBP Acryloylethoxy benzophenone, Prepared using a method acopolymerizable monomer containing a similar to that described inseparately photoreactive group U.S. Patent 7,838,110 B2 (Zhu et al.)IOTG Iso-octyl thioglycolate, a chain transfer agent Evans Chemetics(Teaneck, NJ, USA) Karenz MT Pentaerythritol tetrakis(3-mercaptobutylate), a Showa Denko America Inc. PE1 (PEI) chaintransfer agent (New York, NY, USA) TDDM Tertiary dodecyl mercaptan, achain transfer Sigma-Aldrich (St. Louis, agent MO, USA) IRGAUREEthyl-2,4,6-trimethylbenzoylphenyl- BASF Corporation (Florham TPO-Lphosphinate, a liquid photoinitiator Park, NJ, USA) IRGACURE1-Hydroxy-cyclohexyl-phenyl-ketone, BASF Corporation (Florham 184 aphotoactivated polymerization initiator Park, NJ, USA) VAZO 52(2,2′-azo-bis(2,4-dimethylpentanenitrile), DuPont (Wilmington, DE, athermally activated polymerization initiator USA) VAZO 67(2,2′-azo-bis(2-methylbutanenitrile), DuPont (Wilmington, DE, athermally activated polymerization initiator USA) VAZO 881,1′-azo-bis(cyclohexanecarbonitrile), DuPont (Wilmington, DE, athermally activated polymerization initiator USA) LUPEROX2,5-bis(tert-butylperoxy)-2,5-dimethylhexane, Arkema Incorporated 101 athermally activated polymerization initiator (Philadelphia, PA, USA)LUPEROX 2,5-Dimethy1-2,5-di-(tert-butylperoxy)-3- Arkema Incorporated130 hexyne, (Philadelphia, PA, USA) a thermally activated polymerizationinitiator MeHQ Hydroquinone monomethyl ether, a Sigma-Aldrich (St.Louis, polymerization inhibitor MO, USA) IRGANOXPentaerythritoltetrakis(3-(3,5-ditertbuty1-4- BASF Corporation (Florham1010 hydroxyphenyl)propionate), Park, NJ, USA) an antioxidant EtAc EthylAcetate BDH Chemicals (Radnor, PA, USA) MEK Methyl ethyl ketoneSigma-Aldrich (St. Louis, MO, USA) PrOH n-Propyl alcohol Sigma-Aldrich(St. Louis, MO, USA) DMF Dimethyl formamide Sigma-Aldrich (St. Louis,MO, USA) OC PET SKYROL SH-81, an optically clear polyester SKC, Inc.(Atlanta, GA, film having a thickness of 0.025 millimeters USA)

Optical Properties

Haze, percent transmission, and b* properties were measured using aspectrophotometer in transmission mode (UltraScan PRO Spectrophotometer,available from Hunter Associates Laboratory, Incorporated, Reston, Va.,USA). Optically clear adhesive (OCA) samples prepared between tworelease liners were cut to approximately 5 cm by 5 cm. The thickness ofthe adhesive layer was 150 micrometers. After removal of one of theliners, the sample was laminated to a clear piece of 1 millimeter thickglass using hand pressure insuring no air bubbles get trapped. Thesecond liner was then removed and a layer of optically clear polyesterwas laminated onto the exposed surface of the OCA using hand pressureinsuring no air bubbles get trapped The resulting assembly was evaluatedfor haze using the spectrophotometer in transmission mode. Thewavelength is in the visible range (400 to 700 nanometers). Additionalsamples were prepared in the same manner, aged in a chamber at 65° C.and 90% relative humidity for 800 hours, removed from the chamber,allowed to cool to room temperature, and then evaluated for haze.

Shear Storage Modulus and Glass Transition Temperature (T₂)

The modulus and glass transition temperature (Tg) of adhesive filmsamples were determined using a rheological dynamic analyzer (ModelDHR-3 Rheometer, which is available from TA Instruments, New Castle,Del., USA) in a parallel plate mode. Samples were prepared by coatingthe adhesive onto a silicone release liner and drying at 160° C. in avacuum oven. The resulting film was then pressed at 140° C. to athickness of approximately 1 millimeter (0.039 inches). After allowingto cool at ambient conditions to room temperature (20° C. to 25° C.),samples were then punched out using an 8 millimeter (0.315 inches)diameter circular die, and centered between two parallel plates, eachhaving a diameter of 8 millimeters, after removal of the release liner.The plates with adhesive were positioned in the rheometer and compresseduntil the edges of the adhesive film were uniform with the edges of thetop and bottom plates. The temperature was then ramped in two stages,first from 25° C. to −65° C. at 3° C./minute and, after equilibratingback to 25° C., from 25° C. to 150° C. at 3° C./minute while theparallel plates were oscillated at an angular frequency of 1 radian persecond and a constant strain of 10 percent. The shear storage moduli(G′) and shear loss moduli (G″) were measured and used to calculate tandelta (G″/G′) as a function of temperature. The peak of the tan deltacurve was taken as the glass transition temperature.

Solids Content

Polymer solids content was determined gravimetrically by weighingsamples into an aluminum pan and drying at 160° C. under a vacuum for atleast 45 minutes. Two samples were run and the average value reported.Percent solids are calculated using the following equation.

Wt. % Solids=100[(A−B)/(C−B)]

The variable A is the weight of the dry sample plus aluminum pan. Thevariable B is the weight of the aluminum pan. The variable C is theweight of the wet sample (before drying) plus aluminum pan.

Molecular Weight Distribution

Polymers were evaluated for their molecular weights using gel permeationchromatography (GPC). The polymer was dissolved in tetrahydrofuran at aconcentration of 0.5 percent (weight/volume) and passed through a 0.2micrometer polytetrafluoroethylene filter. Samples of the resultingsolution were analyzed using a Waters Corporation (Milford, Mass., USA)GPC unit equipped with two PLgel 5 micrometer MIXED-D columns (StyragelHR5E 7.8 mm×300 mm) at 35° C. (obtained from Waters Corp., Milford,Mass., USA) and UV (Model 2487) and Refractive Index (Model 2410)detectors. After injection samples were eluted at 1 milliliter/minute.Calibration was carried out using polystyrene standards. The weightaverage molecular weight (Mw) was determined and reported in kilodaltons(kDa).

Creep Compliance

Adhesive polymeric film samples were evaluated for their creepcompliance (J) at various temperatures using a rheological dynamicanalyzer (Model DHR-3 Rheometer, which is available from TA Instruments,New Castle, Del., USA) equipped with a Peltier Plate heating fixture.Samples were prepared by coating the polymeric material onto a siliconerelease liner and drying at 160° C. in a vacuum oven. The resultingpolymeric film was then pressed at 140° C. to a thickness ofapproximately 1 millimeter (0.039 inches). After allowing to cool underambient conditions to room temperature, samples were then punched outusing an 8 millimeter (0.315 inches) diameter circular die, and adheredonto an 8 millimeter diameter upper parallel plate after removal of therelease liner. The plate with polymeric film was positioned over andonto the Peltier Plate in the rheometer with the exposed polymericsample surface contacting the Peltier Plate, and the polymeric filmcompressed until the edges of the sample were uniform with the edges ofthe top plate. The temperature was then equilibrated at the testtemperatures for 2 minutes at a nominal axial force of 0 grams+/−15grams. After two minutes, the axial force controller was disabled inorder to maintain a fixed gap during the remainder of the test. A stressof 8,000 Pascals was applied to the sample for 300 seconds, and thecreep compliance (J) at 287 seconds was recorded.

Examples E1-E13 and Comparative Examples CE1-CE7

For Example 1, 43.5 grams of HA, 5.0 grams of Acm, 1.5 grams of HEA, 0.5grams of a 10 weight percent solution of VAZO 52 in MEK, 0.40 grams of a5 weight percent solution of TDDM in MEK, and 50 grams of MEK were addedto a glass bottle. The contents were mixed and bubbled with nitrogen for2 minutes before being sealed and placed in a Laundrometer rotatingwater bath (SDL Atlas, Rock Hill, S.C., USA) for 24 hours at 60° C.After 24 hours the sample was removed from the Laundrometer and cooledusing ambient conditions. The sample was analyzed using GPC to determinethat the Mw was 186 kDa.

Examples 2-13 and Comparative Example CE1-CE7 were prepared in a mannersimilar to Example 1 except with the modifications shown in Table 2below. Table 2 summarizes the composition used to form the(meth)acrylate copolymer. The amount of the monomers are in weightpercent based on the total weight of monomers. The amount of ABP, theamount of AeBP, the amount of solvent, the amount of IEM, the amount ofVAZO 52, the amount of TDDM, and the amount of PE1 are pph (parts perhundred—amount added based on 100 grams of (meth)acrylate copolymer).

Next, Examples 1-11 and Comparative Example CE1-CE7 were treated withIEM as follows. The sample in a bottle was purged with air followed byaddition of IEM (as a 10 weight percent solution of IEM in MEK) andIRGACURE 184 (or TPO-L) in the amounts shown in Table 3. The amounts inthis table are based on dry parts per hundred parts of dry polymericmaterial. The bottle was sealed and taped shut, and placed on a rollerfor greater than 16 hours. After the first two to four hours, a heatlamp was employed to heat the contents of the bottle to about 60° C. forthe remainder of the time.

The weight average molecular weight, polydispersity index, glasstransition temperature, shear storage modulus, and creep compliance foreach example are shown in Table 4 below.

TABLE 2 Compositions for Examples E1-E13 and Comparative ExamplesCE1-CE7 Ex. ABP or Ethyl VAZO No. 2-EHA 2-OA ISTA IBOA 2-EHMA CHA HA BAAcm HEA AeBP MEK Acetate 52 TDDM PE1 E1  87 10 3 100 0.1 0.04 E2  88 9 3100 0.1 0.04 E3  85 8 7 100 0.1 0.04 E4  60 30 7 3 100 0.1 0.04 E5  89 83 100 0.1 0.15 E6  87 10 3 100 0.1 0.07 E7  39 22 30 6 3 100 0.1 0.04E8  90 7 3 100 0.1 0.04 E9  60 30 7 3 60 0.1 0.1 E10 79 10 8 3 66 0.10.15 E11 27 62 8 3 66 0.1 0.225 E12 42 50 8 0.2 66 0.1 0.035 AeBP E13 4250 8 0.2 66 0.1 0.035 ABP CE1 95 2 3 100 0.1 0.07 CE2 93 4 3 100 0.10.07 CE3 92 5 3 100 0.1 0.07 CE4 91 6 3 100 0.1 0.07 CE5 60 30 7 3 600.1 0.40 CE6 60 30 7 3 60 0.1 0.60 CE7 60 30 7 3 60 0.1 0.06

TABLE 3 Treatment with IEM: Examples E1-E11 and Comparative ExamplesCE1-CE6 IRGACURE 184 IEM TPO-L Ex. No. (pph) (pph) (pph) E1 0.35 0.50 E20.35 0.10 E3 0.35 2.50 E4 0.35 0.50 E5 0.35 0.50 E6 0.35 0.50 E7 0.350.50 E8 0.35 0.50 E9 0.35 0.50 E10 0.35 0.50 E11 0.22 0.50 CE 1 0.350.50 CE 2 0.35 0.50 CE 3 0.35 0.50 CE 4 0.35 0.50 CE 5 0.35 0.50 CE 60.35 0.50

TABLE 4 Characterization of Examples E1-E13 and Comparative ExamplesCE1-CE7 Modulus (G’) at Ex. Mw Polydispersity Tg 25° C. 25° C. 70° C.No. (kDa) Index (° C.) (kPa) J (1/Pa) J (1/Pa) E1  186 3.4 −1.6 1082.42E−04 3.54E−03 E2  187 3.5 −10.1 79 1.27E−04 9.07E−03 E3  193 3.9−8.3 78 1.33E−04 8.77E−03 E4  158 3.9 3.5 118 6.41E−05 5.58E−03 E5  1963.0 −10.2 52 2.72E−04 8.65E−03 E6  199 5.2 2.1 98 1.15E−04 2.99E−03 E7 209 3.8 −5.4 109 7.09E−05 3.36E−03 E8  220 4.2 −3.5 86 9.98E−05 3.80E−03E9  339 3.4 −16.7 64 1.22E−04 2.16E−03 E10 181 3.3 −4.5 80 1.93E−045.05E−03 E11 179 4.8 7.0 51.9 3.21E−04 2.25E−02 E12 258 2.8 −13.1 829.99E−05 3.02E−03 E13 261 2.7 −13.0 75 1.61E−04 3.76E−03 CE1 136 3.7−41.5 2 1.10E−01 2.89E+00 CE2 133 3.7 −30.4 5 2.21E−02 8.26E−01 CE3 1373.5 −23.3 8 9.78E−03 4.75E−01 CE4 133 3.5 −16.8 20 2.31E−03 1.96E−01 CE5102 2.9 −16.8 30 8.08E−04 6.72E−02 CE6 70 2.6 −15.9 16 8.00E−03 2.52E−01CE7 511 2.8 −17.6 60.1 6.78E−05 7.29E−04

Examples E14-E21 and Comparative Example CE8 Example 14: Precursor(2-EHA/BA/Acm/HPA—60/30/7/3) Treated with IEM

A solution was prepared by stirring 57.59 grams 2-EHA, 30.0 grams BA,3.0 grams HPA, 7.0 grams Acm, 7.0 grams DMF, 0.10 grams IRGANOX 1010,1.35 grams of 10.0 weight percent solution of TDDM in 2-EHA, and 0.82grams of a 2.44 weight percent solution of MEHQ in 2-EHA in a 0.24 liter(8 ounce) glass jar and heating to 65° C. After cooling to 50° C., amixture of 0.40 grams of a 0.25 weight percent solution of VAZO 52 in2-EHA was added with mixing. Then 80 grams of this mixture wastransferred to a stainless steel reactor vessel that was part of anadiabatic reaction apparatus (available under the trade designation VSP2from Fauske Associates, LLC, Burr Ridge, Ill., USA). The reactor vesselwas purged of oxygen while heating and pressurized with 414 kPa (60pounds per square inch) of nitrogen gas before reaching the inductiontemperature of 61° C. The polymerization reaction proceeded underadiabatic conditions to a peak reaction temperature of 132° C. A 5.0gram aliquot was taken from the reaction mixture and the percent solidswas 43.45 weight percent based on the total weight of monomers in themixture.

A solution was prepared by mixing 1.0 gram VAZO 52, 0.10 grams VAZO 88,0.05 grams LUPEROX 101, 0.15 grams LUPEROX 130, and 48.7 grams ethylacetate in a 0.12 liter (4 ounce) glass jar. The mixture was shaken on areciprocating mixer to dissolve the solids. Then, 0.7 grams of thesolution was stirred into the reactor vessel. The reactor was purged ofoxygen while heating and then pressurized with 414 kPa (60 pounds persquare inch) of nitrogen gas before reaching the induction temperatureof 59° C. The polymerization reaction proceeded under adiabaticconditions to a peak reaction temperature of 153° C. The mixture washeld at that temperature for 30 minutes then drained into a 0.24 liter(8 ounce) jar. A sample was taken and the percent solids was 90.95weight percent based on the total weight of monomers in the mixture.This sample is a precursor (meth)acrylate copolymer.

The precursor (meth)acrylate copolymer was treated with IEM by thefollowing procedure. 17 grams of polymer was dissolved in 25.5 grams MEKin a 0.12 liter (4 ounce) jar, to which 0.07 grams of IEM and 0.09 gramsTPO-L was added. The bottle was sealed and taped shut, and placed on aroller for greater than 16 hours. After the first two to four hours, aheat lamp was employed to heat the contents of the bottle to about 60°C. for the remainder of the time. The properties for this example are inTable 8 below.

Example 15: Precursor (2-EHA/BA/Acm/HPA—60/30/7/3) Treated with IEM

The following components were added to a 1.8 liter stainless steelreactor vessel that was part of a pressure reactor apparatus (availableunder the trade designation RC1e Process Development Workstation fromMettler-Toledo International, Incorporated, Columbus, Ohio, USA): 574.0grams 2-EHA, 300.0 grams BA, 30.0 grams HPA, 70.0 grams Acm, 70.0 gramsPrOH, 1.0 gram IRGANOX 1010, 8.0 grams of 25.0 weight percent solutionof TDDM in 2-EHA, and 16.2 grams of 1.23 weight percent solution of VAZO52 in 2-EHA. The components were stirred within the reactor vessel. Thereactor vessel was purged of oxygen while heating and pressurized with41 kPa (6 pounds per square inch) of nitrogen gas before reaching theinduction temperature of 61° C. The polymerization reaction proceededunder adiabatic conditions to a peak reaction temperature of 124° C. A15.0 gram aliquot was taken from the reaction mixture and the percentsolids was 35.56 weight percent based on the total weight of monomers inthe mixture.

A solution was prepared by mixing 1.0 gram VAZO 52, 0.10 grams VAZO 88,0.05 grams LUPEROX 101, 0.15 grams LUPEROX 130, and 48.7 grams ethylacetate to a 0.12 liter (4 ounce) glass jar. The mixture was shaken in areciprocating mixer to dissolve the solids. Then, 10.0 grams of thisethyl acetate solution was stirred into the reactor vessel. The reactorwas purged of oxygen while heating and then pressurized with 41 kPa (6pounds per square inch) of nitrogen gas before reaching the inductiontemperature of 59° C. The polymerization reaction proceeded underadiabatic conditions to a peak reaction temperature of 148° C. Roughlyhalf of the batch was drained (486.8 grams) and the remaining polymerwas vacuum stripped in the reactor vessel of residual solvent andmonomers. A sample was taken of the drained polymer and the percentsolids was 91.99 weight percent based on the total weight of monomers inthe mixture.

After vacuum stripping off the solvent and residual monomers, there wasa calculated amount of polymer remaining in the reaction vessel equal to512 grams. Then 1.48 grams of IEM was added in situ to the reactorvessel and the reactor was held above 150° C. for 30 minutes. Next, 3.84grams IRGACURE 184 was added into the reactor vessel. This was stirredfor an additional 30 minutes. A sample was taken from the reactionmixture and the percent reacted was 98.22 weight percent based on thetotal weight of monomers in the mixture.

The properties for this example are in Table 8 below.

Example 16: Precursor (2-EHA/BA/Acm/HPA—39/50/8/3) Treated with IEM

A solution was prepared by stirring 36.89 grams 2-EHA, 50.0 grams BA,3.0 grams HPA, 8.0 grams Acm, 8.0 grams DMF, 0.10 gram IRGANOX 1010,1.50 grams of 10.0 weight percent TDDM in 2-EHA, and 0.41 gram of 2.44weight percent MEHQ in 2-EHA within an 8 ounce glass jar and heating to65° C. After cooling to 50° C., a mixture of 0.36 gram of 0.25 weightpercent solids VAZO 52 in 2-EHA was added and mixed. The reactor waspurged of oxygen while heating and pressurized with 414 kPa (60 poundsper square inch) of nitrogen gas before reaching the inductiontemperature of 61° C. The polymerization reaction proceeded underadiabatic conditions to a peak reaction temperature of 147° C. Analiquot (5.0 grams) was taken from the reaction mixture and the percentreacted was 48.72 weight percent based on the total weight of monomersin the mixture.

A solution was prepared by mixing 0.2 gram VAZO 52 initiator, 0.07 gramVAZO 67 initiator, and 49.73 grams ethyl acetate in a 4 ounce glass jar.The mixture was shaken on a reciprocating mixer to dissolve the solids.Then, 0.7 gram of the solution was stirred into the stainless steelreactor. The reactor was purged of oxygen while heating and thenpressurized with 414 kPa (60 pounds per square inch (psi)) of nitrogengas before reaching the induction temperature of 59° C. Thepolymerization reaction proceeded under adiabatic conditions to a peakreaction temperature of 126° C. The mixture was held at that temperaturefor 30 minutes and then drained into an 8 ounce jar. An aliquot (5.0grams) was taken from the reaction mixture and the percent reacted was77.71 weight percent based on the total weight of monomers in themixture.

A solution was prepared by mixing 1.0 gram VAZO 67 initiator, 0.25 gramVAZO 88 initiator, 0.15 gram LUPEROX 101 peroxide, 0.15 gram LUPEROX 130peroxide, and 48.45 grams ethyl acetate in a 4 ounce glass jar. Themixture was shaken on a reciprocating mixer to dissolve the solids.Then, 0.7 gram of the solution was stirred into the stainless steelreactor. The reactor was purged of oxygen while heating and thenpressurized with 414 kPa (60 pounds per square inch) of nitrogen gasbefore reaching the induction temperature of 80° C. The polymerizationreaction proceeded under adiabatic conditions to a peak reactiontemperature of 123° C. The mixture was isothermally held at thattemperature for 30 minutes and then drained into a 0.24 liter (8 ounce)jar. A sample was taken and the percent solids was 96.46 weight percentbased on the total weight of monomers in the mixture. This sample is aprecursor (meth)acrylate copolymer.

The precursor (meth)acrylate copolymer was treated with IEM by thefollowing procedure. 66.0 grams of polymer was dissolved in 66.0 gramsMEK in a 0.24 liter (8 ounce) jar, to which 0.20 grams of IEM was added.The bottle was sealed and taped shut, and placed on a roller for greaterthan 16 hours. After the first two to four hours, a heat lamp wasemployed to heat the contents of the bottle to about 60° C. for theremainder of the time. 102.0 grams of this mixture was transferred intoa new 0.24 liter (8 ounce) amber jar, to which 0.09 grams IRGACURE 184was added and mixed on a roller for an additional 10 minutes. Theproperties for this example are in Table 8 below.

Example 17: Precursor (2-EHA/BA/Acm/HPA—39/50/8/3) Treated with IEM

Example 17 used the precursor polymer from Example 16. After it wastreated with IEM, 30 grams of the polymer/MEK solution was transferredto 0.12 liter (4 ounce) amber jar, to which 0.08 grams TPO-L and 3.0grams of 50 weight percent solids CN983 in MEK was added and mixed on aroller for an additional 10 minutes. The properties for this example arein Table 8 below.

Example 18: Precursor (2-EHA/BA/Acm/HPA—39/50/8/3) Treated with IEM

Example 18 was prepared in a manner similar to Example 15 except withthe modifications shown in Tables 5-7 and except that a larger reactorvessel (75 gallon) was used. The properties for this example are inTable 8 below.

Example 19: Precursor (2-EHA/BA/Acm/HPA—39/50/8/3) Treated with IEM

Example 19 was prepared in a manner similar to Example 15 except withthe modifications shown in Tables 5-7 and except that a larger reactorvessel (75 gallon) was used. The properties for this example are inTable 8 below.

Example 20: Precursor (2-EHA/BA/Acm/HPA—39/50/8/3) Treated with IEM

Example 20 was prepared in a manner similar to Example 16 except that alarger reactor vessel (300 gallon) was used and its IEMfunctionalization was conducted in situ via the same procedure asExample 15. All other modifications are shown in Tables 5-7. Theproperties for this example are in Table 8 below.

Example 21: Precursor (2-EHA/BA/Acm/HPA—39/50/8/3) Treated with IEM

Example 21 was prepared in a manner similar to Example 16 except that alarger reactor vessel (300 gallon) was used and its IEMfunctionalization was conducted in situ via the same procedure asExample 15. All other modifications are shown in Tables 5-7. Theproperties for this example are in Table 8 below.

Comparative Example 8: Precursor (2-EHA/BA/Acm/HPA—35/55/7/3) Treatedwith IEM

Comparative Example 8 was prepared in a manner similar to Example 15except with the modifications shown in Tables 5-7 and except that alarger reactor vessel (300 gallon) was used. The properties for thisexample are in Table 8 below.

TABLE 5 Compositions Examples E14-E21 and Comparative Example CE8 Ex.2-EHA BA Acm HPA DMF PrOH TDDM No. (wt %) (wt %) (wt %) (wt %) (pph)(pph) (pph) E14 60 30 7 3 7 0.135 E15 60 30 7 3 7 0.20 E16 39 50 8 3 150.15 E17 39 50 8 3 15 0.15 E18 35 55 7 3 8 0.20 E19 39 50 8 3 8 0.165E20 39 50 8 3 15 0.165 E21 39 50 8 3 15 0.165 CE8 35 55 7 3 7 0.20In Table 5, the amounts of monomer are given as weight percent based onthe total weight of monomers in the polymerizable composition. Theamounts of DMF, PrOH, and TDDM are parts per hundred (pph) based on theweight of the (meth)acrylate copolymer.

TABLE 6 Polymerization Conditions: Examples E14-E21 and ComparativeExample CE8 Temp. Temp. Temp. % % % Peak 1 Peak 2 Peak 3 Polymer PolymerPolymer Ex. No. (° C.) (° C.) (° C.) Step 1 Step 2 Step 3 E14 132 153N/A 43.5 91.0 N/A E15 124 148 N/A 35.6 92.0 N/A E16 147 126 123 48.777.7 96.5 E17 147 126 123 48.7 77.7 96.5 E18 125 198 N/A 27.3 NT N/A E19131 190 N/A 31.9 NT N/A E20 130 139 122 32.1 67.8 NT E21 122 138 14725.4 69 NT CE8 132 182 N/A 31.0 NT N/A N/A: Not Applicable NT: NotTested

TABLE 7 Treatment with IEM: Examples E14-E21 and Comparative Example CE8Ex. IEM Addition IEM, TPO-L, IRGACURE CN983 No. Method (pph) (pph) 184,(pph) (pph) E14 MEK Solution 0.40 0.50 E15 In situ 0.29 0.75 E16 MEKSolution 0.60 0.50 E17 MEK Solution 0.60 0.18 10 E18 In situ 0.40 0.75E19 In situ 0.40 0.75 E20 In situ 0.40 0.35 E21 In situ 0.40 0.35 CE8 Insitu 0.40 0.75

TABLE 8 Properties for Examples E14-E21 and Comparative Example CE8Modulus Poly- (G’) Optical Ex. Mw dispersity Tg at 25° C. Trans Haze 25°C. 70° C. No. (kDa) Index (° C.) (kPa) (%) b* (%) J (1/Pa) J (1/Pa) E14101 6.2 −15.0 50.6 NT NT NT 3.74E−04 1.27E−02 E15 157 7.5 −12.0 57.0 NTNT NT 3.77E−04 2.75E−02 E16 253 6.6 −13.1 61.6 NT NT NT 1.35E−048.07E−03 E17 253 6.6 −15.0 52.6 NT NT NT 4.47E−04 2.37E−02 E18 216 13.2−7.6 60.7 94.4 0.23 0.50 3.60E−04 1.94E−02 E19 250 11.8 −6.3 74.8 94.40.44 0.89 2.12E−04 1.31E−02 E20 235 8.8 −5.3 91.9 NT NT NT 1.16E−047.48E−03 E21 248 11.8 −6.5 64.2 NT NT NT 3.64E−04 2.14E−02 CE8 211 11.6−20.1 28.6 95.6 0.12 0.44 1.12E−03 5.36E−02 NT: Not Tested

We claim:
 1. A curable adhesive composition comprising a curable(meth)acrylate copolymer having a weight average molecular weight in arange of 150,000 to 400,000 Da, wherein the curable (meth)acrylatecopolymer comprises: a) a first monomeric unit of Formula (I) in anamount in a range of 50 to 94 weight percent based on a total weight ofmonomeric units in the curable (meth)acrylate copolymer

wherein R₁ is hydrogen or methyl; and R₂ is an alkyl, heteroalkyl, aryl,aralkyl, or alkaryl group; b) a second monomeric unit of Formula (II) inan amount in a range of 6 to 10 weight percent based on the total weightof monomeric units in the curable (meth)acrylate copolymer

wherein R₁ is hydrogen or methyl; c) a third monomeric unit of Formula(III) in an amount in a range of 0.05 to 5 weight percent based on thetotal weight of monomeric units of the curable (meth)acrylate copolymer

wherein R₁ is hydrogen or methyl; R₃ comprises an aromatic ketone groupthat causes hydrogen abstraction from a polymeric chain when exposed toultraviolet radiation; and d) a fourth monomeric unit of Formula (IV) inan amount in a range of 0.1 to 20 weight percent based on the totalweight of monomeric units of the curable (meth)acrylate copolymer

wherein R₁ is hydrogen or methyl; X is —O— or —NH—; R₄ is ahydroxy-substituted alkyl or hydroxy-substituted heteroalkyl group; andwherein the curable (meth)acrylate copolymer contains 0 to less than 0.1weight percent of acidic monomeric units based on a total weight of the(meth)acylate copolymer; the curable adhesive composition has a creepcompliance that is less than 5(10⁻⁴) inverse Pascals at 25° C.; thecurable adhesive composition has a creep compliance that is greater than1(10⁻³) inverse Pascals at 70° C.; and the curable adhesive compositionhas a shear storage modulus equal to at least 40 kiloPascals (kPa) whenmeasured at 25° C. and at a frequency of 1 radian/second.
 2. The curableadhesive composition of claim 1, wherein the curable (meth)acrylatecopolymer further comprises a fifth monomeric unit that is anitrogen-containing monomeric unit not of Formula (II).
 3. The curableadhesive composition of claim 1, wherein the curable (meth)acrylatecopolymer is free or substantially free of monomeric units derived froma vinyl ester monomer or an anhydride-containing monomer.
 4. The curableadhesive composition of claim 1, wherein the curable (meth)acrylatecopolymer has a glass transition temperature equal to at least −15° C.when measured using Dynamic Mechanical Analysis at a frequency of 1radian/second.
 5. A cured adhesive composition comprising a cured(meth)acrylate copolymer, the cured adhesive composition being areaction product resulting from exposing a curable adhesive compositionto ultraviolet or visible light radiation, wherein the curable adhesivecomposition is of claim
 1. 6. The cured adhesive composition of claim 5,wherein the cured adhesive composition is optically clear.
 7. An articlecomprising a first substrate and a layer of the curable adhesivecomposition of claim 1 positioned adjacent to the first substrate. 8.The article of claim 7, wherein the layer of the curable adhesivecomposition is a die-cut film.
 9. The article of claim 7, wherein thefirst substrate is a release liner.
 10. The article of claim 8, whereinthe article further comprises a second substrate and the die-cut film ispositioned between the first substrate that is the release liner and asecond substrate, the second substrate being a second release liner oran optical substrate.
 11. An article comprising a first substrate, asecond substrate, and a layer of the cured adhesive composition of claim5, wherein the layer of the cured adhesive composition is positionedbetween the first substrate and the second substrate.
 12. A method ofpreparing an article, the method comprising: providing a firstsubstrate, a second substrate, and a curable adhesive composition layerof claim 1; forming a laminate comprising the first substrate, thesecond substrate, and the curable adhesive composition layer, whereinthe curable adhesive composition layer is positioned between the firstsubstrate and the second substrate; and exposing the curable adhesivecomposition layer to ultraviolet or visible light radiation to form acured adhesive composition layer.
 13. The method of claim 12, wherein atleast one of the first substrate and the second substrate has at leastone feature and wherein forming the laminate comprises flowing thecurable adhesive composition to cover an outer surface of the feature.14. The method of claim 12, wherein the curable adhesive compositionlayer is cut with a die to have dimensions suitable for positioningbetween the first substrate and the second substrate.